Electronics Forum | Tue Aug 25 08:51:16 EDT 1998 | Justin Medernach
| | | Hi, | | | Does anyone has experiences in reflowing Ceramic BGA and found solder wicking ? Solder wicking has the syndrome that solder being wick from the pad and ended up in the leads. | | | We have rule out the possibility of not printing any
Electronics Forum | Tue Jul 14 12:02:51 EDT 1998 | Ryan
| | What is the range of temperature at the tip of most soldering irons? I was told that 90% of tips operate at between 430 and 460 F. Can someone verify this for me? I need this info to recommend the proper soldering aids for repair and rework. | |
Electronics Forum | Tue Jun 16 09:15:56 EDT 1998 | Justin Medernach
| We are very concerned about microcracking in SMT P&P process. I want to know something about: | What is microcracking? | When did it occur? What are the causes? | How can avuid this phenomena? Toni, Micro cracks can be caused by a ton of conditions
Electronics Forum | Fri Apr 03 08:19:36 EST 1998 | Jon Medernach
| Hello, | We are currently trying to design and ultimately implement a system that will be able to count and manage component placement for three Sanyo chipshooters on three SMT lines. | As the number of components decreases in the reels we want to
Electronics Forum | Mon Jan 26 04:48:48 EST 1998 | Grant Petty
| Is there any way to implement SMT at home? | I want to assemble a prototype board of mine. | How can I hand-solder a 208-pin 0.5 mm lead | pitch PQFP -- lead-by-lead (the usual way), | or side-by-side (partial heating method)? | Alas, no SMD rework
Electronics Forum | Fri Oct 05 07:46:24 EDT 2001 | george
Specifications of testing force are not fixed, but (incase of wave soldering) the value should be at least 120-150 % of the force the wave. So for small chip components we assume that the force from the wave on the component is about 3 Newton, this m
Electronics Forum | Tue Sep 18 16:48:55 EDT 2001 | jschake
Why do you think that assembling the BGA, QFP, and fine pitch parts will solve your bridging problem? I would think doing this may cause you more grief by having these more massive components being reflowed upside down fall off during the second pas
Electronics Forum | Wed Oct 10 20:35:17 EDT 2001 | djarvis
Stephen, I don't understand this at all mate. 1. If you don't place a QFP and get bridging across the bare pads, you were gonna get absolutely horrendous bridging if you did put one down. That points to poor printer set up or stencil design or both
Electronics Forum | Thu Jun 13 11:27:25 EDT 2002 | davef
>*Changing paste >EricD: Yes we are considering that as a point. Because I believe the paste we are using are in syringe packaged and designed for dispensing. We are using an Indium SMQ75 paste and current application naturally is stencil printing.
Electronics Forum | Fri Sep 06 15:11:09 EDT 2002 | genny
Management is talking about the ability to do all our assembly in house. I would assume that realistically that we would eventually limit it to a few key products, but we are a high mix, relatively low volume company with volumes going up. We have
