Electronics Forum | Wed Aug 27 15:48:05 EDT 2008 | grics
Again, our paste manufacturer specifies TAL to be 30-60 seconds. Out of curiousity, how would part placement cause de-wetting? I am fairly new to SMT so elaboration would be helpful... Thanks
Electronics Forum | Tue Aug 26 13:28:50 EDT 2008 | qaman
I am new to the board so be gentle with me. There are standards such as IPC-610 for PCB assembly, IPC-600 for bare boards, etc. Is there a "standard" for electro-mechanical assembly? Is there an IPC standard or any other industry approved standard
Electronics Forum | Tue Sep 02 13:30:05 EDT 2008 | evtimov
I am new to the board so be gentle with me. > There are standards such as IPC-610 for PCB > assembly, IPC-600 for bare boards, etc. Is there > a "standard" for electro-mechanical assembly? Is > there an IPC standard or any other industry > appro
Electronics Forum | Mon Sep 08 12:43:15 EDT 2008 | linny999
hello, Try Allen at Attek LLC 970 443 9233 he should be able to help you out. Ian
Electronics Forum | Sun Aug 31 05:38:13 EDT 2008 | yiannis
hello Are there users of TRS-14 REFLOW OVEN ? Some files of the software are corrupted and we cant use it. If anyone can help plz send a mail :yiannispd@yahoo.gr thnks :-)
Electronics Forum | Sat Sep 06 10:09:57 EDT 2008 | davef
We can't help but wonder: * What are the measured temperatures on a good solder connection and the picture connection? * Why use use Type 4 solder paste?
Electronics Forum | Tue Sep 16 21:52:19 EDT 2008 | rayjr1491
10x16 by 5 mil stencil gives me a area ratio of .615 unless I am calculating incorrectly. I will try and attach some images tomorrow. By reducing the Y direction my area ratio s below .6 and I thought this was not advisable. Your help is muc appreci
Electronics Forum | Thu Sep 18 14:57:19 EDT 2008 | james93
Hi Does anyone know the cause and cure for a QALIGN DEVICE1 TIME OUT / SYSTEM ERROR when a QSP-2 machine is initializing any help would be most welcome
Electronics Forum | Mon Sep 22 04:59:10 EDT 2008 | fadzil66
I have concern about cleaning solder ball after misprinting paste on PCB, currently use vigon 200 with ultrasonic generate but only 70% solder ball able to remove, Any other method or equipment can help to clean solder ball.
Electronics Forum | Mon Sep 22 12:31:10 EDT 2008 | ppcbs
We are looking for assistance with completing our Section 8a certification. Can anyone refer a company or consultant that helps with this process?
