Electronics Forum | Wed Sep 06 18:19:37 EDT 2017 | slthomas
Hi All, We are being intermittently challenged by a .5mm pitch uBGA paste release issue. We don't build with many of these so don't have a lot of history here. We've gone through 3 different stencil designs and the most consistent performer was 4 m
Electronics Forum | Thu Sep 07 10:18:24 EDT 2017 | capse
Chrys Shea has published extensively on stencil materials, coatings and paste release mechanisms. Many of the papers are available to download on her website. Just search for Shea Engineering Services. I've worked with Chrys in the past, she is defin
Electronics Forum | Fri Dec 01 13:30:08 EST 2017 | kojotssss
Stencil thickness is 4 mil. Via's are plugging from bottom. Gas may be developed under the component? Take Reflow Ovens Thermal Profiling changes? In your opinion?