Electronics Forum: boarded (Page 319 of 1638)

DRY SOLDERNG

Electronics Forum | Sat Jun 26 15:20:56 EDT 2004 | russ

Are you saying that immediately after the initial assembly process the boards work and then after these same boards sit for 15 days they don't? If that's the case I would suspect contamination maybe. what type of flux are you using and what is your

In same board both leaded and lead-free components used.

Electronics Forum | Tue Jul 13 06:49:53 EDT 2004 | imtiaz

In one board we are using 213 SMT components out of which 23 components are lead-free and the rest are leaded. The paste used is also leaded. Do we have to make any changes in the profile of our reflow oven ? Also will there be any negative effect on

HASL Plating Thickness

Electronics Forum | Tue Jul 27 06:08:18 EDT 2004 | C Lampron

Good Morning Everyone, Could someone please tell me what the acceptable range is for HASL plating thickness. We have some raw boards with plating thicknesses ranging from 3-4 mils on a fine pitch QFP. We are expeiencing bridging at this location an

HASL Plating Thickness

Electronics Forum | Tue Jul 27 11:34:05 EDT 2004 | C Lampron

Nippy, This is exactly what we are seeing. The exessive pads are all on one side of the board. This is a 10 up panel 5x2. All of the QFP's on one side on the panel are not releasing or are not gasketing and causing bridging. So the defects are rangi

Crystalized Flux under BGA

Electronics Forum | Wed Aug 04 16:46:40 EDT 2004 | davef

We assume this is different discussion that the discussion about "crystallized flux under BGA". Correct? Milky residue with water washing makes us think "noclean flux res that just got washed". We know what you said, but we can't help ourselves.

Inspection criteria on PIH parts

Electronics Forum | Wed Aug 04 17:16:13 EDT 2004 | Richard

Can anyone comment on inspection criteria for PIH applications. I'm of the opinion that the inspection criteria used for wave soldered joints should be used for PIH. Some colleagues believe that a bottom side fillet is not necessary since the solde

If we could bake the Board with OSP finish?

Electronics Forum | Fri Aug 06 10:07:50 EDT 2004 | blnorman

OSP has limited elevated temperature exposure capability. Couple that with the fact that solvents (IPA in particular) will remove the OSP. The more material you loose the higher the chances for pad oxidation. We ran an experiment with board washin

Connector SMT assembly pads.

Electronics Forum | Tue Aug 31 20:40:43 EDT 2004 | davef

Please excuse us if we seem dense, but we're stuggling to understand your problem. Are you seeking a supplier for pads [like those used to repair boards] that you can epoxy to your board? If so look here: http://www.circuittechctr.com/products/cond

Lead Free ...

Electronics Forum | Mon Sep 26 20:10:58 EDT 2005 | Anna

What type of alloy and at what temperature do you use for wave soldering? Do you need to modify your machine? I am using SCN but I have problem controlling my bath. Are you running on multilayer board or PTH boards? Do you face any fillet lifting

Print solder paste on test pad on OSP board

Electronics Forum | Tue Sep 14 08:14:07 EDT 2004 | Rob

Hi, There are "Fluxbuster" or "Rotator" pins on the market - we had to use them a few years ago on a flexy board (with OSP). There is some info from one source at the following link: http://www.isiconnectors.com/mfrs/idi/idipr.htm#Rotator We got


boarded searches for Companies, Equipment, Machines, Suppliers & Information

Pillarhouse USA for Selective Soldering Needs

Wave Soldering 101 Training Course
Pillarhouse USA for handload Selective Soldering Needs

High Precision Fluid Dispensers
Best SMT Reflow Oven

World's Best Reflow Oven Customizable for Unique Applications


"回流焊炉"