Electronics Forum: having (Page 3198 of 3474)

What is the rootcause for BGA Lifted PAD after reflow

Electronics Forum | Tue May 20 09:34:28 EDT 2008 | roc2x

Well something is different isn't it? * Paste * > Part supplier * Board fabrication * Was the > profile that you reference the measured > temperature or the the settings keyed into the > oven? > > The cross sections seem to show less > than exp

Leaded and Lead-Free Wave Parameters

Electronics Forum | Wed May 21 13:59:19 EDT 2008 | pjc

Here's what I've seen for no-clean flux applications: Leaded: Dwell Time is? 2 - 3 seconds Top side board temp max? If some small SMT parts reflow are we too hot? 110 to 120C top side board temp just before hitting the wave(s) Pot temp. 245C Lea

CP6-4000 nozzle centering errors?

Electronics Forum | Thu May 29 14:57:26 EDT 2008 | rodrigo

Hi all, Is it normal for some of the small nozzles to be rejected by the wide view camera? Every time I do a nozzle centering the narrow view camera shows green circles for nozzles 1,2,3,4. The larger ones (5 and 6) show the asterisk. The wide view c

SMT Process Engineering Consulting Rates

Electronics Forum | Mon Jun 02 15:38:20 EDT 2008 | wavemasterlarry

I have a pretty good system for my counsultency rates of charge. It is a multi-tire system so to speak.I took a seminar on value stream mapping which is how come I know this stuff.I catgorize my consulting fees by area of expertise of course. Exampl

Curing Conformal Coating

Electronics Forum | Thu Jun 05 05:27:13 EDT 2008 | andy1975

Hi, I've been looking into UV cureable conformal coating and the UV ovens but a chemist I know is very negative about this. He suggest by heating standard conformal coating to 90deg for a couple of minutes will make the product good enough to handle

Solder Splash

Electronics Forum | Wed Jun 18 09:13:44 EDT 2008 | realchunks

You're barking up the wrong tree. Solder "splashes" are generally caused by your print being off pad a bit. They are called solder fines. I've never seen a placement machine have the capability to push paste around using it's kiss-off from the noz

Need SMT Tech

Electronics Forum | Wed Jun 18 12:56:31 EDT 2008 | ampearl

I need to find a qualified candidate to join a communications company in the SMT department. The project calls for an individual who has worked with product development building prototypes and testing them in an R&D environment, as well as workin

CCGA solderability criteria

Electronics Forum | Sat Jun 21 23:15:07 EDT 2008 | mika

Also keep in mind that the CCGA column length tolerance is at minimum +/- 0.13mm from most part manufactures and they don't collapse in the same way as a BGA, therefore the paste height deposit could be critical in some rare circumstances. Board warp

Rollback the Lead-Free Initiative by Dr. Howard Johnson

Electronics Forum | Tue Jul 08 12:04:31 EDT 2008 | patrickbruneel

Military is outside the scope of the directive. The RoHS directive is mainly focused on electronic equipment with a high potential to end up in the normal waste stream such as consumer products. The EU commission also knows that removing lead from a

Rollback the Lead-Free Initiative by Dr. Howard Johnson

Electronics Forum | Wed Jul 09 18:36:08 EDT 2008 | jmelson

Just to clarify, I tried to read a summary of the Oko institute report, but it was in some word processor format I wasn't quite compatible with. But, I did get some of it. It appeared to restrict ANY use of nickel (couldn't tell if that was in allo


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