Electronics Forum | Sat Mar 20 00:33:28 EST 1999 | Mike C
| We are having a small number (~2%) of our boards pass our manufacturing diagnostics, fail once they reach the customer, fail when they get back to us and then start working again after handling them for a short time. We have eliminated a lot of it
Electronics Forum | Fri Feb 26 10:33:17 EST 1999 | Dave F
Cunli: I think the phrases are worded accurately and don't think rewording them would change the situation. Other options to consider are: 1 Make the old thread current, after someone makes a new posting 2 Just make the new message a new thread, th
Electronics Forum | Thu Feb 25 22:01:52 EST 1999 | Chris G.
| Read an earlier thread about using glass slugs to determine placement CPk. Can it actually be done this way? What's the procedure? Be interesting to know 'cause if it's feasible, I'd probably get myself a kit. None of us here are stat's experts
Electronics Forum | Fri Feb 19 09:14:52 EST 1999 | Justin Medernach
| During inspection and test we find leads which do not get soldered. Some are because of insufficient paste, but with others everything looks right. This will only happen on 1 to 2 pins, and it is not isolated to a specific type of ic or location o
Electronics Forum | Fri Feb 19 13:54:22 EST 1999 | Tuffty
| Hey all- | | My question is this: My stencil printer operator has said that he has to | wipe our 6-mil stencil each pass to get the paste in the 20-mill pitch | aperatures for a QFP to release well. We are using Amtech NC-559 type 3 | paste with
Electronics Forum | Sat Feb 20 23:08:36 EST 1999 | GORDON DURPHEY
| Hey all- | | My question is this: My stencil printer operator has said that he has to | wipe our 6-mil stencil each pass to get the paste in the 20-mill pitch | aperatures for a QFP to release well. We are using Amtech NC-559 type 3 | paste with
Electronics Forum | Tue Feb 23 09:51:35 EST 1999 | Steve Schrader
| Hey all- | | My question is this: My stencil printer operator has said that he has to | wipe our 6-mil stencil each pass to get the paste in the 20-mill pitch | aperatures for a QFP to release well. We are using Amtech NC-559 type 3 | paste with
Electronics Forum | Wed Feb 10 07:01:49 EST 1999 | Joe
We use both F4G and MCS at the present and we are phasing out MCS. One main reason is that it's platform is not Y2K compliant. F4G is cumbersome and taxes a high overhead on your computer system. We have also found a bug recently when we have high
Electronics Forum | Wed Feb 03 22:37:50 EST 1999 | Dave F
| I'd like to find some technical papers on the reliability of reworked BGAs. If you know of any, please let me know. | | I have a concern about this because our current rework process does not apply solder paste to the pads prior to placing the pa
Electronics Forum | Fri Feb 05 12:50:06 EST 1999 | Steve Gregory
| Love the picture. | | We are considering the PRC 1500. It combines a thermoflo unit with a MBT 250A which we currently use. Does anyone know the difference between the TF200 and the TF700? This is the first I have seen the TF700 mentioned. | |
