Electronics Forum | Tue Jul 16 04:38:23 EDT 2002 | bayanbaru
Hi, Is there any ESD system that do not requires the ESD wrist/heel strap testing? You see one problem we face is meeting the wrist strap testing compliance. There bound to have some operator fail to carry out the wrist strap test. How can we preven
Electronics Forum | Tue Jul 23 12:40:22 EDT 2002 | patrickbruneel
I'm glad to see so much awareness of the challanges the US manufacturing industry is facing. But in problem solving you first have to realize that there is a problem before a solution can be worked out. I firmly believe that if we could convince the
Electronics Forum | Mon Jul 15 10:56:48 EDT 2002 | jseagle
I see this all the time and we are an OEM that can specify how parts are to be packaged. That being said, purchasing is always having problems finding the part in the specified packaging and end up buying it however they can get it. It's not like w
Electronics Forum | Thu Jul 25 22:03:50 EDT 2002 | davef
I need help understanding your problem. * What�s the difference between �e-test failure� and �total failure�? * Why do you think that an ESD induced failure would only be a �total failure�? * What if this is caused by a cracked solder connection? Yo
Electronics Forum | Thu Aug 01 08:58:47 EDT 2002 | Rick Lathrop
Good morning Dave F. I am not going to try to touchup the solder pad until I get surface analysis work done, don't want to ruin the evidence. I am getting XPS work done not XRF, XPS is X-ray Photoelectron Spectroscopy and can see very thin films of o
Electronics Forum | Tue Jul 30 08:40:43 EDT 2002 | pteerink
I have used both. The moles both do the same basic functions. Software options are a little different for each. If you're just looking for basic profiles/oven qualification, either will do a fine job. If you're wanting more in-depth details, I'd su
Electronics Forum | Thu Aug 01 10:09:31 EDT 2002 | sueph
Dave, I would have never thought of the sheet metal box. My west coast contact, who has dealt with this type of board before, told me yesterday to go ahead and try it at this profile anyway, as the metal plating holds more heat. I was pleasantly
Electronics Forum | Wed Jul 31 06:50:10 EDT 2002 | mzaboogie
We have recently implemented a selective solder process using no clean flux. We have experienced a problem with "micro solder balls" Some of them are not so "micro". The equipment manufacturer stated that this is a common problem with no clean select
Electronics Forum | Wed Aug 07 05:08:04 EDT 2002 | matherat
This sounds like it could be a SIPAD solid solder application. Bring the boards in with the solderpaste already on them in a flattened solid form. Then you could print glue on them without disturbing wet paste. 1.Print glue. (Might take a little
Electronics Forum | Thu Aug 15 13:36:44 EDT 2002 | kenbliss
I would take the following method to start Which defect is taking the most labor time to fix. which defect is causing a bottleneck to your production. Fix the one causing the bottleneck first as it will improve your plant output and profits Then
