Electronics Forum | Thu Sep 21 13:27:09 EDT 2006 | jimmyjames
We 'bend and clip' with good old fashioned needle nose pliers and side cutters. A typical size for a run would be 20-30 boards. Many of our designs are over a decade old and are fully TSO'd (FAA standard) and we can't change anything in the design.
Electronics Forum | Wed Jul 25 11:55:21 EDT 2007 | ck_the_flip
Zoinks!! Doing the homeplate design on 0402 will actually make your tombstones WORSE! Think about it. Your wetting forces are now on the ENDS of the device with no solder paste toward the middle of the device to tack the part down - a gauranteed f
Electronics Forum | Wed Nov 14 14:44:10 EST 2007 | grantp
Hi, Those via's sure do sound large, and I think the designer must have made a mistake in the PCB design do you think? From looking at our PCB designs, if we moved to via in pad, it would really reduce the size of the PCB, so this is an important i
Electronics Forum | Tue Nov 27 10:26:22 EST 2007 | ck_the_flip
Alot of that depends on your designs as well. Poor designs with lots of DFM violations WILL require a full-time tech./engineer, whereas with good designs, a conscientious operator (who regularly cleans the nozzles) should be good enough. As Chunks
Electronics Forum | Fri Jan 11 15:16:46 EST 2008 | jaimebc
Our programs are created in an ASCII format ( we do not have Unicam or Circuit cam )So using Microsoft Excel,we open/load the finished PNP program and then we sort it by reference designator. Still in Excel, we then open/load the BOM (in an ASCII)
Electronics Forum | Wed Sep 03 17:44:07 EDT 2008 | Frank
Not to quibble, but I have been a Juki user for over 12 years and starting with the Juki machines 750/760 and all machines since support 8 characters for reference designators. We are even looking to upgrade later next year and they have already con
Electronics Forum | Wed Jan 07 02:08:56 EST 2009 | sachu_70
Hi! Just joined the circuit. Hot Bar soldering is very reliable provided the Flexible Printed Circuit (FPC) and Rigid PCB design support this technique. Some of the critical aspects that need to be considered include Stencil apperture design for sold
Electronics Forum | Wed Jun 24 18:44:14 EDT 2009 | mark_h
Hi Everyone My company has done loads of 0402 placements but are now required to start looking at 0201 and micro BGA placements. I’ve done loads of research and I’m happy with stencil design, area ratio, oven profile, machine requirements and paste r
Electronics Forum | Mon Jul 26 08:25:18 EDT 2010 | markgray
In our organization our cells are setup and designed in a Kaizen event. In the Kaizen participation is with assemblers, engineering, management, and a few other departments. We have very simple rules going into the event. First and formost is that ra
Electronics Forum | Thu Sep 02 15:01:52 EDT 2010 | James Neal
Manufacturing-wise, is there a problem with doing a single panel with both four layer and two layers designs on it? I do prototype runs with multiple designs on the same panel, and I'd like to start including four layer. It seems to me that I can g