Electronics Forum | Sun Mar 24 23:11:36 EST 2002 | sy_koh
I am looking technology for BCC package. The preliminary datasheet from customer show that it had rectangular flat pad on the joint. The smallest pitch is 0.6mm having 96 I/Os. I am currently putting BGA, uBGA, CSP and CBGA onto PCBs usinf no-clean
Electronics Forum | Wed Apr 10 22:25:29 EDT 2002 | davef
BAKING MSD AT 5% You can bake at any RH% you�d like. The further you get from 5%, the longer it takes. Those guys in production are just bustin� ya. For background, look at: * http://www.seikausa.com/mcdrysmt.pdf * http://www.aecouncil.com/Papers
Electronics Forum | Wed Aug 14 16:30:55 EDT 2002 | sleech
Dan: Until I got deep into development of a vacuum assisted moisture removal process, I always thought that the bake process would be saddled by the lack of atmosphere in the chamber. I later learned that the conduction of temperature at reduced atm
Electronics Forum | Sun Nov 24 10:12:44 EST 2002 | kcorrin
Thanks for your response Dave. I did look at the bare boards after wave solder and they seem to solder fine in that process. I do not see any soldermask bleed on bare boards. Regarding "thin" plating...I have had issues in the past when the board sup
Electronics Forum | Wed Aug 20 09:15:10 EDT 2003 | John S
My company is developing a product that will require solder paste to be printed on a piece of cast aluminum. The surface of the casting is not completely flat. It has been recommended that one way to work around this might be to use a screen instea
Electronics Forum | Tue Aug 26 14:13:46 EDT 2003 | robd
We have seen "coplanar problems" on BGAs supplied by some suppliers. We have seen large enough spere variation to cause opens with our standard .006" paste process (paste and profile work fine "most" of the time) . Although not an extremely technic
Electronics Forum | Thu Sep 25 18:37:36 EDT 2003 | adlsmt
Grind the point on a pogo pin from an in-circuit test fixture flat and push on a leg of the component till it bends, mark the deflection, then add about 30% to the length that the pin pushed in (maybe more if your using no clean and the residue adds
Electronics Forum | Wed Mar 31 13:05:46 EST 2004 | JoeH
Anyone used this package? It's Cygnal PN C8051F300. The part has bottom side, flat terminations (like a BGA without the balls). There is metalization on the sides of the package but it's not plated (bare copper). Metalization on the bottom is pla
Electronics Forum | Mon Jul 26 09:19:57 EDT 2004 | davef
Both imm silver and ENIG provide flat surfaces that are better for fine pitch placement and reflow than HASL. We know of nothing that makes BGA locations different than other locations when using ENIG solderability protection. More broadly, the pri
Electronics Forum | Mon Aug 02 16:54:07 EDT 2004 | davef
If you eliminate this test, how would you monitor the cleanliness of your: * Bare boards * Components * Processes You probably could get a c of c from your board fab, but a c of c from the component suppliers would be burdonsome [and agruably useles
