Electronics Forum | Thu Apr 15 10:09:55 EDT 2010 | davef
Dross formation rates for SnCu and SAC are roughly 2.5 times the rate for SnPb (Hwang et al., 2004) Methods for reducing dross are: * Lower pot temperature * Run pump speed slower and only when soldering * Check solder contaminants to BS219, ASTM
Electronics Forum | Fri Jul 08 08:20:32 EDT 2005 | teilo
Hello we manufacture titanium retrofit kits with a 5mm titnaium tank we have done 7 conversions for Sony , Wahl in Hungary , Fextronics in Ireland without any problems at all. If you require additional information please do not hesitate to contact m
Electronics Forum | Tue Feb 16 16:28:30 EST 1999 | Tuffty
| | Can anyone help me with the pros and cons of trying to wave | | solder tantalum and large (1812) ceramic capacitors. I do | | know that one may see fractures on larger cermaic caps, but have not seen much on the tantalums. Any insight as to what
Electronics Forum | Mon Apr 26 09:54:59 EDT 2010 | baildl632
What type of wave machine? Does your machine have a pump speed dial? Does your machine have the ability to raise and lower the pot? Raise pot to as close as possible to the pallets/boards and make sure they can pass over the nozzle without hanging o
Electronics Forum | Fri Mar 17 21:44:14 EST 2000 | sosina_outry
Daren: suggestion from a friend of mine 1. Is residue on the top or bottom of the board? If on the bottom, then you might need to do solder dedross. if on the top, you might need to check 1. after spray flux, check for any excess flux on the top of
Electronics Forum | Mon Apr 03 01:17:37 EDT 2000 | cpgoh
I ever thot of changing the whole solder pot altogether but then it prove to be a costly measures.. If looking at the source of the problem, it might be mainly due to the way that the machine had been maintain... Anyone care to share how they are per
Electronics Forum | Mon Apr 19 11:36:10 EDT 2010 | baildl632
We installed a fixed distance optical sensor above the conveyor rail and "wired it" throught he machines terminal bus to cut the pump on only when a board was present at the pot. We also installed a timer in line so the pump would only stay on long e
Electronics Forum | Thu Mar 30 11:07:41 EST 2000 | Wolfgang Busko
> the dirty patch appear seems to be a bit powdery on top of stickiness > the "harden" dirt in the solder pot or at pump are ususally "knock" out while cleaning.. is that thorough enough..? Assuming that 1) is true it might not be thorough enough. On
Electronics Forum | Fri May 26 01:50:54 EDT 2000 | Craig
We have no experience in printing glue only in dispencing for short runs. We are finding that our gluing volumes are going up and want to look at screen printing as an option. We are placing 0805 and 1206 chips, melfs, sots and ics. What are the adva
Electronics Forum | Thu Mar 30 04:42:28 EST 2000 | cpgoh
HI all, thanks for the advise.. Electrovert is being used from 7am to 7pm and we do dedross from the surface of the solder bath during lunch time around 12nn. Break Time we just sweep them to the side.. Every two week, we do the solder bath maintena
