Electronics Forum: (4) (Page 325 of 664)

HighMixLowVolume P&P Equipment selection

Electronics Forum | Thu Jan 29 08:28:12 EST 2004 | stefwitt

You get this info from the sales people. However, here is a simple formula. Your machine places actual 10,000 comp. an hour and you do this 7 hours a day, 5 days a week. Take some weeks off and calculate with 50 weeks, then your machine does 17,500,0

Moisture Sensative Components

Electronics Forum | Thu Feb 05 15:38:21 EST 2004 | mrmaint

Pete C We do bake our tray parts. I am familiar with the ipc specs. The problem is for example: a level 4 component can only be out a total of 72 hrs before rebake is required. If this is a tube or reel part, the 125c bake temp that is recommended wi

siplace s-15 scanning unit DP

Electronics Forum | Fri Feb 27 10:12:36 EST 2004 | stefwitt

The front plate of the S15 head gives you access to the signal amplifier boards. You'll find 4 potentiometers adjusting the voltage and the symmetry of track A and B. A digital scope turned to X+Y provides an image of a circle, which is been adjusted

BGA/Fine pitch footprints

Electronics Forum | Tue Mar 02 10:19:41 EST 2004 | loz

Hi all, we have recently seen a design that consists off a QFP100, pitch at 25". Also in the centre of this footprint is a FBGA165 footprint, pad size .4mm @ 1mm pitch. We have been informed that we will fit the QFP. I want to remove the BGA pads fr

Voiding in board to BGA joints

Electronics Forum | Sat Mar 06 02:54:25 EST 2004 | tommy

1)Solder paste selection 2)Reflow profile.Focus on soaking and TAL. 3)Moisture control for BGA. 4)Maybe the BGA solder ball already with void. 5)PCB design.Any via on bga land? 6)Solder masking type. 7)Solder paste volume apply on land. 8)IPC class 3

Cracked Tantalum Capacitors

Electronics Forum | Mon Mar 08 14:39:54 EST 2004 | Gabriele

Have you considered those Tant Caps could be moisture Sensitive Components ? During last year, several Brand Suplliers classified their Tant Caps as Moisture Sensitive Level 2a (4 wks out of dry pack before reflow, see J-STD-033a) some even MSL:3

No Clean vs. RMA

Electronics Forum | Wed Mar 24 20:10:06 EST 2004 | Ken

IF you open up your TV, cd player or color printer you will see RA / RMA flux ON EVERYTHING! The waxy binder protects the halogenated compounds from becoming active with atmospheric moisture. Self healing is a good way to look at it. However, OA is

Pressure check for SMT machine placement.

Electronics Forum | Mon Apr 12 04:56:54 EDT 2004 | qualitel

Hi Eric, Every mounter have a standard count and "release" off the component. The sample and cost saving way is to use the paper (e.g: 4mil,5mil...thick) to measure. Just place on the PCB with supoort base below and release the nozzle step by

Reflow profiler / mole /Thermal Couple

Electronics Forum | Sun May 09 04:18:04 EDT 2004 | Mark Stansfield

Have you taken a look at our SolderStar range of profilers. We offer 4,6 and 12 channel versions. Our 12 channel system can also be connected to our Wave Shuttle product for wave solder machine analysis. Our datalogger are the smallest reflow profile

Nitrogen Reflow Oven

Electronics Forum | Sun Apr 04 15:33:01 EDT 2004 | Jimmy

We are looking at several reflow ovens with intent to acquire one for both air and nitrogen reflow capability (i.e. have the capability to reflow in either air or nitrogen environment). Would be interested to know what I should look for in comparing


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