Electronics Forum | Tue Oct 25 13:55:26 EDT 2005 | Joe Wesley
Looking for idea''s on how to reduce cracking of components along viscore. We are placing within 0.020 and0.030 from edge in some cases but are seeing cracks on components placed all the way out at 0.150 off edge. Has anyone heard heating the boards
Electronics Forum | Mon Oct 31 08:29:51 EST 2005 | chunks
Shifting? Please describe the "Shifting". I.E. is it centering, sliding to cause shorts..... Most 208s will self center. If it's causing shorts, first check your print to make sure it is on the pads. Next check placement. Another area to check
Electronics Forum | Mon Oct 31 09:52:23 EST 2005 | slthomas
The only problems I've ever had with 208's shifting out of alignment was with a board with too much HASL thickness. The lands had a convex profile and the parts kept slipping downslope. We put down a glue dot and ranted at our board supplier. Both
Electronics Forum | Mon Oct 31 08:51:05 EST 2005 | Amol
what methods are being used by folks in the industry for identifing LF ckt boards on the factory floor. I have a list of methods that an be used (like diff solder maks color, LF bar codes, LF logos and so on) but would appreicate your inputs on the s
Electronics Forum | Wed Nov 09 13:46:07 EST 2005 | russ
Anybody out there have any experience with the above? We are looking into buying one of these things. We need to process large thin boards to small thick boards both pb and pbfree solders. Components will range from uBGA and CSP to ????? It is a
Electronics Forum | Tue Nov 15 09:50:40 EST 2005 | chunks
Good ol'Wenesco. That's one of my old products they have in their advertising. The tricky part about dip process is in the fluxing. Spray fluxing a populated board from the bottom looking up can be a challenge. You'll notice the areas you missed
Electronics Forum | Mon Nov 28 11:35:37 EST 2005 | stepheniii
There is also peelable or watersoluble masking. I've only seen the peelable masking used. Not ten minutes ago an engineer showed me a board a customer was having trouble with that they are waveing all the bottom parts. That board should be selectiv
Electronics Forum | Wed Dec 14 06:18:20 EST 2005 | tk380514
right again grant, consider the fact that if you spend enough time inspecting the soldered boards/pre-oven and check the BGA solder paste pads before, and clean the stencil regularly and check solder paste dryness, check oven profiles then after chec
Electronics Forum | Sat Dec 10 07:33:09 EST 2005 | davef
Most board fabricators define a range of processes parameters that are routine for their plant set-up and methods. Look here http://www.divsys.com/ServicesProducts/PCB/MfgCapabilities.asp for an example. If you don't define your requirements, you'
Electronics Forum | Wed Dec 14 06:32:20 EST 2005 | tk380514
Not all but some new boards we have had solder joint problems, for example some of the pads refuse to solder at all and the solder paste ends up attched only to the leg, reworking makes no difference and a variety of fluxes have failed. How can some
