Electronics Forum | Fri Feb 09 17:09:29 EST 2007 | flipit
I think it depends on the shield and how it is configured. If your shield has some openings and your placement process is good, you can try it and see how it goes. I place small shields on small PCBs (1" X 2") and have no problems. There are 20 mi
Electronics Forum | Thu Feb 08 14:55:30 EST 2007 | pavel_murtishev
Good evening, I do. 2mil overprint is not critical. Paste will simply flow back. Paste flows back even with larger overprint (up to 15mil at least). 5mil stencil thickness if fine also. BGA area ratio for both BGAs is higher than 0.66 required by IP
Electronics Forum | Mon Feb 12 13:58:10 EST 2007 | campos
Tks for the answers,, My concern is about the intermetalic layer,,I run SMQ230 LEAD FREE paste.. its liquidous at 217C..the oven have 7 zone, but I run in 5 zones also with a more agressive profile (due to the line rate)..I would like to know if runn
Electronics Forum | Fri Feb 16 15:21:42 EST 2007 | ck_the_flip
CK, I'm also "CK", but have been C.K. since way back. See my old posting, from 1999: http://www.smtnet.com/Forums/index.cfm?fuseaction=view_thread&CFApp=1&Thread_ID=2819&#Message11498 Anyway, I now go by "CK the Flip" to avoid confusion to this f
Electronics Forum | Thu Feb 15 16:01:53 EST 2007 | jdengler
Bert, Clean the emitter disk of the nozzle you use for this part. Set everything in the PD back to where it should be and set the "Lead_check_area" to 10. This will look at 10% of the end of the leads. This will help if the leads do not have even
Electronics Forum | Thu Feb 15 21:09:45 EST 2007 | Stephen- SMT engineer trainee
1. Can anyone tell me about the water absorption(wt%) among different PCB((i) RoHS, (ii)non-RoHS, (iii) Halogen free)), I am currently facing the problems of PCB blisters after reflow process. 2. Also, please suggest the baking period/time among dif
Electronics Forum | Mon Feb 19 12:07:22 EST 2007 | Mario
We would need to set up a line capable of placing ca. 70 million of components/year (preferably in one shift). It will be single product, so changeover is of no importance. Also, there's no need for extreme precision. I would prefer two separate line
Electronics Forum | Fri Mar 02 14:43:28 EST 2007 | stimpk
Are you using lead free paste also? Are all the other parts on side 1 ROHOS ? etc.. can they handle your leadfree profile. Those need answered 1st. But to answer your question. Yes you can run the BGA side 1st ( hopefully with leadfree paste and ho
Electronics Forum | Mon Mar 05 13:25:45 EST 2007 | jmelson
I will have to rent a forklift to get it off the truck. If I don't cut the wall first, then the machine sits in the garage while the rental is ticking away at $200+ a day. Also, moving it twice doubles the possibility of a catastrophe. I've got so
Electronics Forum | Thu Mar 01 16:47:05 EST 2007 | ratsalad
The guys that take our dross (and pay us for it) take our barrels that contain scrapped solder paste as well. Also in the barrels are the nitrile gloves and disposable towels used in solder paste handling and cleaning. They pay us for the metal c
