Electronics Forum | Wed Jan 19 11:37:18 EST 2000 | Mark D. Milward
Does anyone consider the use of a Cyberoptics LSM solder paste thickness measurement system to be a valid test in determining the viscosity of solder paste. This procedure was proposed as an alternative to using the Malcolm gage for viscosity testing
Electronics Forum | Fri Jan 14 09:17:08 EST 2000 | Wolfgang Busko
You need to have the right cutter for that and the necessary skill too. "Erem" a company from switzerland does have a very good cutter for that. I�ve seen cutting done with high speed miniflex ( those dentists tools ) too. Desoldering with a minitip-
Electronics Forum | Wed Jan 12 11:54:13 EST 2000 | Chen Zhou
Vishy, We have a project to study the impact of productivity lift in SMT lines using discrete event simulation tools (AutoMod is what we use). As Mr. Lahat found out, the high fidelity simulation of productivity lift is non-trivial. However, we have
Electronics Forum | Thu Jan 06 01:55:01 EST 2000 | Roni Haviv
From my experience: It's depends on your messurment tools and the component: - Average high (at least 3 messurment points) should be 6 mils max. (you'll always get pick points of 4-7 mils!). - It depends on component tech./pitch: in pitches great
Electronics Forum | Mon Dec 27 12:24:47 EST 1999 | RICK_EEI
Hi everyone. We use a small ultrasonic aqueous cleaner. After each PCB we hand solder, (water soluble) we place it in the cleaner immediately. Lately we have had some problems with the solder joints appearing to be corroding away. We tried lowering t
Electronics Forum | Fri Dec 17 08:45:26 EST 1999 | Wolfgang Busko
Hi Henry, amoung all things that cause this funny effect the most effective measures in my experience were good PCB design (pads and equal thermal conditions for both sides of the components), placement accuracy and profiling, profiling, profiling. L
Electronics Forum | Fri Dec 10 09:32:04 EST 1999 | Dave F
Joe: It might be tough to generalize about the number of times you can reform a lead before it is weakened beyond the point of reuse, because of different lead materials, thicknesses, amount of bending etc. It might be that "ugliness" is the answer
Electronics Forum | Sat Dec 04 02:21:32 EST 1999 | Vinesh Gandhi
Hi All, I am facing a strange problem. One of my esteemed & valued customers has an unusual requirement of cleaning the board with IPA after soldering is complete. I am using alpha metals UP78 no clean sodler paste during reflow. This IPA cleanin
Electronics Forum | Fri Nov 19 11:07:17 EST 1999 | Bob Smith
Hi John, I don't know of any posters etc. but specs. are available free on-line at www.jedec.com for classification, time out of packaging before baking is required, bake times & temperatures. My understanding is that it only causes a problem if th
Electronics Forum | Fri Oct 29 02:07:48 EDT 1999 | Eom In Soub
hi. guys Have you out there ever seen the crack by means of humidity after reflow solering. We cannot analyze the cause of the tsop crack. The shape of crack seem to be hitted by sharp stuff. but there is no scar around crack . TSOP shaped long rec
