Electronics Forum | Thu Feb 10 13:06:05 EST 2000 | Chris McDonald
Instead of spending 15k on a spray fluxer spend a little bit on your foam tower. The narrower the foam head the less flux being applied. You might have to modify the foam tower but if works. I would switch fluxes though there are others out there tha
Electronics Forum | Thu Jan 27 14:16:14 EST 2000 | Tuan Bui
I've tried Indium NC-SMQ92(96.5Sn 3.5Ag) on these MCMs and achieved only marginal wetting on pads and parts. The good wetting is what I try to achieve, shiny is what my engineers want (Prototype environment). Does pre-cleaning the PWBs in ultrasonic
Electronics Forum | Tue Jan 04 07:22:12 EST 2000 | Michael Selva
One of the boards has a via designed right in the middle of a pad for a 1206 cap, one side only. This causes the solder paste to run into the via during reflow. We run No-Clean paste. One alternative is to increase the aperture on the stencil for tha
Electronics Forum | Fri Dec 31 20:21:26 EST 1999 | Stu Leech
Intel had a similar problem with one of their military packages. They had "dull" leads. QC screamed loudly about this because the "dull" leads looked like a solder-coating problem. (Actually the solderability was equal or better than the "shinny" lea
Electronics Forum | Thu Dec 09 00:15:55 EST 1999 | Vinesh Gandhi
Thanks for your feedback. I definitely agree with your viewpoints. Can you send across any documents/papers through e-mail or post them on the smtnet which clearly describes the HARMFUL EFFECTS OF WHITE RESIDUES. My customer's only apprehension is
Electronics Forum | Mon Dec 13 16:07:38 EST 1999 | Travson
Russ, Regarding your no clean soldering to gold. We have been doing that for about three years now. We have been using 62/36/2% silver solder paste. I have not done any thorough testing as to joint strength but the finish is shinier. It looks li
Electronics Forum | Fri Dec 03 15:38:13 EST 1999 | DaveH
Jason, Something which has not been addressed in the responses so far is the system which utilizes high volume (flow rate of chemistry over the product), versus high pressure, which indeed has the potential to damage very fine webs on fine pitch sten
Electronics Forum | Wed Nov 17 10:47:47 EST 1999 | Rob Fischer
CDM is a quality material. Life expectancy can't be stated in time but should be termed in cycles. I'm aware of companies with more than 50,000 passes. These companies have a documented maintenence program for their pallets including PM and cleani
Electronics Forum | Wed Nov 10 11:52:50 EST 1999 | Wolfgang Busko
All good points to check. But consider that once you have dross in the pump mechanism it�s hard to get it out quick through normal operation. You might empty the pot and clean it sorrowly to get it out of all corners and parts where it sticks. I had
Electronics Forum | Mon Nov 01 16:41:58 EST 1999 | Robert Culpepper
Hello Mark, I can�t provide any hands on feedback with 0402 packages but we are using a no clean process with 0603 devices. Here are some parameters which will affect solder balling. Stencil thickness, aperture size, paste viscosity, snap off and bot
