Electronics Forum: recommendation (Page 327 of 392)

Re: Pre-heat for Ceramic Capacitors

Electronics Forum | Sat Mar 06 08:01:45 EST 1999 | Scott Cook

| Can someone please advise me to the rework procedure for removal and replacing Ceramic Chip Capacitors (e.g. 0805, 1206, etc.)? | | Is it necessary to pre-heat ceramic capacitors before soldering them onto a PCB with a soldering iron? Is this just

Re: Squeegee Speed

Electronics Forum | Tue Feb 23 09:51:35 EST 1999 | Steve Schrader

| Hey all- | | My question is this: My stencil printer operator has said that he has to | wipe our 6-mil stencil each pass to get the paste in the 20-mill pitch | aperatures for a QFP to release well. We are using Amtech NC-559 type 3 | paste with

Re: Fiducials

Electronics Forum | Fri Feb 19 00:32:40 EST 1999 | ZEEK

| We are using .040" diameter fiducials (global and local) on our boards. They are solder covered and HASL. I get batches of boards where the p&p vision system has trouble reading the fiducial. The fiducial looks dark on the screen. The board ven

Re: Looking for MRP/MES software.

Electronics Forum | Wed Feb 10 00:07:15 EST 1999 | Jason

Gary, I am also evaluating MRP/ERP systems. I have had many demos. I have looked at SAP R3, and actually used it at a previous employer, very complex system and a bit pricey. SAP is at http://www.sap.com , others I have looked at are Acacia Tech

New SMTnet Site Changes

Electronics Forum | Fri Feb 05 11:34:44 EST 1999 | Clifford Peaslee @ SMTnet

SMTnet Site Changes This weekend SMTnet will get a facelift. We have redesigned some of our serviecs, and have added new ones. Some of the new features are SMTnet Email, New Database Driven PCBCE Mart, New Directory Database With Enhanced Searching a

New SMTnet Site Changes

Electronics Forum | Fri Feb 05 11:32:08 EST 1999 | Clifford Peaslee @ SMTnet

SMTnet Site Changes This weekend SMTnet will get a facelift. We have redesigned some of our serviecs, and have added new ones. Some of the new features are SMTnet Email, New Database Driven PCBCE Mart, New Directory Database With Enhanced Searching a

Re: Reliability of Reworked BGAs/CSPs

Electronics Forum | Wed Feb 03 22:37:50 EST 1999 | Dave F

| I'd like to find some technical papers on the reliability of reworked BGAs. If you know of any, please let me know. | | I have a concern about this because our current rework process does not apply solder paste to the pads prior to placing the pa

Re: Reliability of Reworked BGAs/CSPs

Electronics Forum | Thu Feb 04 15:44:04 EST 1999 | Michael Allen

Actually, solder paste adds about 12% to the joint volume for PBGAs, or about 31% for MicroBGAs -- assuming standard (recommended) pad sizes and stencil thicknesses, and paste with 90% metal content (50% metal by volume). | | I'd like to find some t

Re: Pace TF700, here's what it looks like...

Electronics Forum | Fri Feb 05 12:50:06 EST 1999 | Steve Gregory

| Love the picture. | | We are considering the PRC 1500. It combines a thermoflo unit with a MBT 250A which we currently use. Does anyone know the difference between the TF200 and the TF700? This is the first I have seen the TF700 mentioned. | |

Re: Moisture Sensitivity and Package Cracking

Electronics Forum | Mon Feb 01 10:06:51 EST 1999 | Chris Fontaine

All of our moisture sensitive components are shipped to us in vacuum sealed, desiccated bags with a moisture indicator. When the parts are removed from the bag (this is done at either SMT setup, or in the stockroom) the indicator is checked. If it


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