Electronics Forum: 2008 (Page 328 of 429)

0.5mm CSP Reliability

Electronics Forum | Wed Apr 23 21:34:24 EDT 2008 | fowlerchang

It is CSP reliability issue, which is the mobile CPU from Spreadtrum. All the tests passed and shipped to customer. They assembly them and tested but failed. After they reflow this CSP with hot air gun, some of the boards passed. We got some board

Aqueous Cleaning PCB's with Potentiometers

Electronics Forum | Tue Apr 29 13:43:34 EDT 2008 | arminski

THANKS FOR YOUR REPLY GUYS... more background... solder paste is Water Soluble. We mask the potentiometers prior to aqeous washing using solder mask, then our operator brush the solder joints with IPA after the Wash Process...I'm concerned about th

Removing Markings from Devices

Electronics Forum | Wed Apr 30 10:43:28 EDT 2008 | dyoungquist

This runs up a big caution flag in my mind! Counterfiet parts are often produced by removing the original markings and remarking the ICs with different part and lot numbers. I am not accusing you of this BUT we have recently been bit by counterfei

Removing Markings from Devices

Electronics Forum | Mon May 05 19:45:39 EDT 2008 | hegemon

Yep, many of us have seen this firsthand. I had a customer who fouled up a job, then "found" a deal on some (10) very expensive Xylinx parts, and badly needed these parts to complete the job. Everything looked good afterwards, but nothing worked. X

Leaded and Lead Free BGA's on hte same board

Electronics Forum | Wed Apr 30 12:26:10 EDT 2008 | dphilbrick

There must be discussions about this on SMTnet but I have yet to find them. I would like to hear from all you smart people about running LF and PB BGA�s on the same board using 63/37 solder. If you run your profile up to peak at around 225C +/- (nitr

RF shield clips

Electronics Forum | Thu May 01 08:35:11 EDT 2008 | cyber_wolf

We are having issues with these parts tilting to one side during reflow. Of course when they are tilted, they have to be reworked because the shield won't fit on. Changing board design and part design is not an option.... I think there are 2 reasons

No flow underfills

Electronics Forum | Thu May 01 09:26:53 EDT 2008 | scottp

Voiding was also the issue I had. I could reduce them substantially by pre-baking the boards, but that's obviously not desirable. Hopefully the chemists have come up with a solution. I extruded some pretty cool looking solder shorts through the vo

Pb-Free BGA on SnPb Assemblies

Electronics Forum | Thu May 01 16:27:04 EDT 2008 | chrisawallace

As Mark stated in a different reply, we also send our Pb-free BGA's out to be re-balled with SnPb paste so that we don't have to elevate the reflow temperatures. You have to be careful regarding the individual components on your boards as although m

Pb-Free BGA on SnPb Assemblies

Electronics Forum | Fri May 02 08:44:36 EDT 2008 | realchunks

Sure you can. But I don't have the time, money or resourses to do this. I do not have the luxery of only getting SnPb parts. Wish I did, but I don't. As for temp specs, I know the specs on all my parts. We profile our ovens every month. We can

Good Lead-Free soldering Iron???

Electronics Forum | Thu May 08 09:56:09 EDT 2008 | mjz289

I agree with dlm. We have been using Hakko irons for our lesd free soldering for about 6 months now. They work great and the tips are relatively inexpensive - $9 to $15, plus they last a very long time compared to our previous brand that we used. The


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