Electronics Forum | Fri Dec 10 09:32:04 EST 1999 | Dave F
Joe: It might be tough to generalize about the number of times you can reform a lead before it is weakened beyond the point of reuse, because of different lead materials, thicknesses, amount of bending etc. It might be that "ugliness" is the answer
Electronics Forum | Sat Dec 04 02:21:32 EST 1999 | Vinesh Gandhi
Hi All, I am facing a strange problem. One of my esteemed & valued customers has an unusual requirement of cleaning the board with IPA after soldering is complete. I am using alpha metals UP78 no clean sodler paste during reflow. This IPA cleanin
Electronics Forum | Fri Nov 19 11:07:17 EST 1999 | Bob Smith
Hi John, I don't know of any posters etc. but specs. are available free on-line at www.jedec.com for classification, time out of packaging before baking is required, bake times & temperatures. My understanding is that it only causes a problem if th
Electronics Forum | Fri Oct 29 02:07:48 EDT 1999 | Eom In Soub
hi. guys Have you out there ever seen the crack by means of humidity after reflow solering. We cannot analyze the cause of the tsop crack. The shape of crack seem to be hitted by sharp stuff. but there is no scar around crack . TSOP shaped long rec
Electronics Forum | Tue Oct 26 08:17:54 EDT 1999 | William
Dave, Last question(s). What do I do about a gold porosity problem? Dave: How would I approach the board house to check for this? They use a very well known chemistry, but is that where the pblm lies? Or would it be in their process, cycle times
Electronics Forum | Mon Oct 25 16:12:52 EDT 1999 | Joe
Dave: Thanks for the info, I appreciate it. You start off by naming a +/- 2 sigma process, is that equivalant to an AQL of 0.25 ? What is a 6 sigma equivalant to? You mentioned the AQL at incoming inspection, what should that be in relationship to
Electronics Forum | Mon Nov 08 09:30:15 EST 1999 | John Burris
I just wanted to thank all of you who responded via e-mail to me regarding this subject. After a lot of looking and talking, I decided to keep using Unicam. I'm working on adapting my use of UC to fit my process a bit better, and hopfully, more effic
Electronics Forum | Thu Oct 21 10:13:19 EDT 1999 | Bill Bannister
The Brady PAM 5000 may work for you as well. I think they have a web site. This machine is smema compatible. It's automatically places barcode labels onto pcb's within an 18"x22" area with .020" accuracy. The labels can be placed at 0 or 90 deg onto
Electronics Forum | Sun Oct 17 23:17:01 EDT 1999 | MJI
I'm interested in the various ways to assure that the fingers on a wave machine are not bent or crooked - beyond a monthly or quarterly maintenance regimen. In fact, how do you know all's well even right after maintenance? That is, making sure that
Electronics Forum | Thu Oct 14 20:42:07 EDT 1999 | Jeff Ferry
Grace, As deifned in IPC 7721 Procedure 3.2 Bow and Twist Repair "Bow and twist after soldering shall not exceed 1.5% for through hole PC boards and .75% for surface mount PC boards. The bow and twist shall not be sufficient to cause difficulties d
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