Electronics Forum | Sat Dec 28 02:58:12 EST 2002 | emeto
If the problem is in the big thermal pad.The surface strains in that pad are different then the others and through the reflow period there is an affinity between them(only if they are too close). I recommend you to reduce the theramal pad. Make smal
Electronics Forum | Tue Jan 07 18:07:59 EST 2003 | davef
J-STD-001 prescribes acceptable temperature and humidity ranges for electronic assembly, but does not discuss required instrumentation, nor its accuracy nor coverage. We're unaware of another standard that requires such a thing. The standards of to
Electronics Forum | Sun Jan 19 10:45:04 EST 2003 | davef
For laminated FR4 PCB, we bake between 6 and 24 hours at 100�C. [Search for other bake recipes in the fine SMTnet Archives.] Alot of the determination of baking time is a function of: * Amount of moisture absorbed. * Amount of moisture you need to r
Electronics Forum | Wed Feb 05 09:11:05 EST 2003 | davef
Here is some talk about MLC capacitor flex cracking...what happens with depanelizing: http://www.kemet.com/KEMET/web/homepage/kechome.nsf/vapubfiles/f2106/$file/f2106.pdf Here are some other files on breaking capacitors: http://www.avxcorp.com/doc
Electronics Forum | Tue Feb 11 12:59:26 EST 2003 | matherat
The assembly process involves activity before you get to reflow. Reflowing is the easy part. Putting paste down and placing parts in wet paste is the terrifying part. Benchtop reflow ovens can be a real handy tool for small production but with the g
Electronics Forum | Tue Feb 11 16:27:18 EST 2003 | Chad
Currently we hand-assemble all prototypes, usually quantities less than ten. I mentioned the 5 to 50 number because a client will occasionally request more than ten, which has been handled previously by using an outside contract manufacturer (we are
Electronics Forum | Fri Feb 28 01:10:32 EST 2003 | MA/NY DDave
Hi I don't know what FR4 you are using, so check it out to make sure 125 isn't too high. I have seen this done occassionally when the PCBs have bad moisture or other problemx where baking helps prior to assembly and solder, yet I haven't seen it do
Electronics Forum | Fri Feb 28 10:29:58 EST 2003 | ksfacinelli
I am working on the process for build of a product that will have a 150 pin AMP PCMCIA connector on the bottom side of the laminate. I am trying to get a selective solder pallet to protect the connector through wave. If this doesn't work I will nee
Electronics Forum | Mon Mar 17 09:53:21 EST 2003 | Rob
I used the MS Outlook exchange sever task list very successfully for a similar situation. Which allows you to set up a shared folder between you and lead assembler. Everyone can electronically view (read only) your production schedule, and email noti
Electronics Forum | Sun Mar 02 21:33:58 EST 2003 | caldon
I like the Idea of supporting the PCB during assembly but do not know if I am sold on TA system of doing such. The TA system does not lend it self well to any Engineering changes. The concept is sound but feel the system from Airline Hydraulics is a
