Industry News | 2014-09-23 11:18:59.0
Indium Corporation's Dr. Ning-Cheng Lee, vice president of technology, will present a technical paper at the 9th International Microsystems, Packaging, Assembly, Circuits Technology Conference (IMPACT), Oct. 22-24 in Taipei, Taiwan. Dr. Lee will present Voiding and Reliability of BGA Assemblies Produced with SAC and BiSnAg Solder Alloys.
Industry News | 2019-05-20 18:51:08.0
SHENMAO America, Inc. introduces PF735-PQ10 Low Temperature Solder Paste. Qualified by a third-party organization, the PQ10 series of low temperature solder paste is made with a modified Sn/Bi alloy that has a lower melting point range from 137°~142°C to 137°~170°C. This makes it ideal for SMT devices, which can have sensitive components that cannot withstand higher temperatures.
Industry News | 2019-07-09 20:13:00.0
SHENMAO America, Inc. is pleased to announce that it will exhibit at the SMTA Ohio Expo & Tech Forum, scheduled to take place Thursday, August 8, 2019 at the Holiday Inn Cleveland Strongsville in Strongsville. The company will showcase its PF735-PQ10 low temperature solder paste.
Industry News | 2013-02-27 11:15:11.0
Multitest, will exhibit in Booth #K4 at the Burn-in & Test Strategies Workshop (BiTS), scheduled to take place March 3-6, 2013 in Mesa, AZ.
Industry News | 2014-08-12 13:50:53.0
Indium Corporation's Wisdom Qu, assistant technical manager, and Fengying Zhou, research chemist, will present at the SMTA China South Conference Aug. 26-28 in Shenzhen, China.
Industry News | 2017-09-18 16:56:43.0
With the publication of the current bi-annual accounts, Viscom AG presents record results across all sales regions. The strong sales development of +27.8 percent over last year confirms the international success track of the innovation and quality leader in the area of high-value inspection solutions for the electronics industry.
Industry News | 2002-05-07 09:13:04.0
Launched to Serve the Mixed-signal and RF Semiconductor Segments
Industry News | 2015-12-01 12:28:44.0
Pulse Electronics Corporation introduces a new internal dual-band flexible printed circuit (FPC) antenna to provide connectivity and data transmission for Internet of Things applications in security, home automation, appliances, lighting, medical/telemedicine, sensors, network monitoring, data collection, wearables, automotive, in-vehicle communication, and vending. The Plume Series W3315B0100 WiFi very compact 6 x 45mm antenna has a maximum antenna gain of 2dBi on the low band and 5dBi on the upper band with over 60% efficiency across the bands.
Industry News | 2021-11-24 15:44:53.0
Durafuse™ LT, Indium Corporation's award-winning low-temperature alloy technology, will be the focus of a presentation by Dr. HongWen Zhang at the International Microsystems, Packaging, Assembly and Circuits Technology conference (IMPACT), Dec. 21-23, Taipei, Taiwan.
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