Industry News | 2010-10-20 22:42:40.0
Everett Charles Technologies’ (ECT) Contact Products Group (CPG) will showcase the latest additions to its ZIP™ family of “flat” technology Pogo® pins in Booth 104 at the upcoming International Test Conference
Everett Charles Technologies (acquired by LTX-Credence, which was acquired by Cohu)
Industry News | 2010-12-01 13:36:54.0
Although all five models in Manncorp’s latest-generation MC series pick-and-place systems have received industry acclaim, one system in particular has stood out for its extraordinary price/performance ratio, according to CEO Henry Mann.
Industry News | 2011-03-28 13:38:37.0
The continued popularity of LEDs – most notably in automobiles, energy-conserving lighting and consumer electronics – has caused Manncorp to roll out another LED-enabled pick and place system. The MC-392LED, according to CEO Henry Mann, "has features that will win approval from traditional SMD assemblers as well as those who mount diodes."
Industry News | 2011-02-26 16:22:43.0
Everett Charles Technologies' (ECT) Contact Products Group (CPG) will showcase the latest additions to its ZIP® family of flat technology Pogo® pins in Booth A04 at the upcoming BiTS™ Burn-In & Test Socket Workshop, scheduled to take place March 6-9, 2011 at the Hilton Phoenix East/Mesa Hotel in Mesa, AZ.
Everett Charles Technologies (acquired by LTX-Credence, which was acquired by Cohu)
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Parts & Supplies | Pick and Place/Feeders
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Parts & Supplies | Pick and Place/Feeders
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Parts & Supplies | Pick and Place/Feeders
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Electronics Forum | Tue Jan 30 21:14:26 EST 2001 | davef
Suggestions are: * Limit pad width to 0.008" [0.2mm] * Use IPC-7525 Stencil Design Guidelines * Avoid Type 4 pastes, if you can * Slow down your print head to 0.63"/sec [16 mm/sec] * Consider the suggestions on printing by rpereira in the past
Electronics Forum | Mon Aug 16 13:38:35 EDT 2010 | rl
i would like to request some advice on manually dispensing paste for super fine pitch components. first some background. i am a small design house and specialize in sub-miniature prototypes for avionics. so far, i have mostly used stainless steel st
Electronics Forum | Sun Oct 08 00:18:05 EDT 2000 | Arturo
We are working with a 16mil TSOP Land width=0.2mm(8mil) and use: 1.Type 4 particle size solder paste. 2.Laser cut electropolished stencil: Aperture width=0.19mm (we tried lower than this but had solder insufficiency). Thickness=0.005"(130 microns)
