Electronics Forum | Thu May 05 14:58:20 EDT 2005 | russ
Looked at it on the web, I believe that it will place those 600 parts in less than 2 hours! And you guys were thinking that it is slow? Ken, not only will it solder those parts with its blazing speed but did you know that you don't even need a sten
Electronics Forum | Thu Mar 06 10:57:28 EST 2003 | Mark
What are the recommended stencil apertures for a TSOP40. Lead pitch 0.48mm & lead width 0.21mm. And direction of squeegee print over the aperture? Recommended Stencil thickness? Recommended aperture reductions? Recommended pcb pad sizes? Recommended
Electronics Forum | Fri Mar 07 14:09:16 EST 2003 | davef
Q1: What are the recommended stencil apertures for a TSOP40. Lead pitch 0.48mm & lead width 0.21mm. A1: We've talked about this previously here on SMTnet, for instance check the fine SMTnet Archives: http://www.smtnet.com//forums/index.cfm?fuseactio
Electronics Forum | Fri Mar 07 21:02:21 EST 2003 | neil
When printing below .5mm pitch, the recommended stencil thickness is 5Thou, laser cut. Do not use any reduction and ensure wherever possible the pad to space ration is 1:1, the length of the pad is not as important as the gap between adjacent pads. T
Electronics Forum | Tue Feb 04 22:28:16 EST 2003 | davef
You could reduce the paste by about 70%. Solder balling and tombstoning will be the issues to fight. The drivers to these don't change with the component size. Use the fine SMTnet Archives for background. Aperture Size and Thickness of Solder Pas
Electronics Forum | Fri Sep 21 14:03:45 EDT 2001 | jschake
I have observed solder balling for all aperture sizes tested. Solder balling levels appear to be better correlated against the amount of solder paste that is underneath the 0201 component terminations after placement rather than comparing this to th
Electronics Forum | Fri Oct 04 11:46:31 EDT 2002 | mzaboogie
Hi Dave, No we are placing these parts on hard boards. Thank God! Thanks Chris
Electronics Forum | Thu Oct 03 15:14:46 EDT 2002 | SMTGuy
Good Day Everyone, Can anyone offer any advice on 0201 aperture design? We are looking at an application that will require them. We would like to do some experimentation first. Also, assuming an OA flux, would we need a type 4 or 5 powder paste to p
Electronics Forum | Thu Sep 20 17:24:29 EDT 2001 | steveb
Have you seen any solder beading (balling) with the aperture sizes you have been using on 0201 components? Have you experimented with some of the solder bead reducing designs?
Electronics Forum | Fri Oct 04 01:18:27 EDT 2002 | sarge
1.5. Width >= 4-5 Particle Diameters. Use the smallest opening to determine this. Using dimension of the smallest aperture width, you should be able to fit minimum of 4-5 solder balls side by side into the opening. For 0201 design, -400 mesh (type
