Electronics Forum | Fri May 01 14:46:52 EDT 2015 | aprosser
Good afternoon, We are running some aluminum boards through a 7 zone reflow oven which have 2 4 pin right angled headers on the ends that are skewing. Does anyone have any suggestions to prevent this from happening?
Electronics Forum | Wed Feb 13 20:15:36 EST 2019 | aldrich17
They all rotate on the same belt but, 2 per head on heads 2, 4, 6, and 8. Placed on the front and back. Held by a bracket with 2 screws. But no matter how tight I set the screws upon adjustment they still get out of whack.
Electronics Forum | Thu Jul 25 11:31:08 EDT 2019 | capse
I represent ECD in the SE USA. They offer the SmartDRY product line. https://smartdry.ecd.com/home.aspx?_fs=b739965c-8be2-4bec-b5b7-7abd6fe5b0fb
Electronics Forum | Fri Aug 28 14:53:16 EDT 2020 | dekhead
It is not abnormal for the first 2-4 prints to be compensation strokes where the print pressure stablises to its set pressure, ideally the variation is
Electronics Forum | Wed Dec 19 14:02:18 EST 2007 | gersla
We decided to bake components in tray package at 70 Degree prior soldering. I am looking for suggestion regarding baking time for MSL3 components: Up to 1.4mm package thickness 1.4-2 mm thickness 2-4.5 mm thickness In JEDEC-033B this temperature is n
Electronics Forum | Wed Dec 04 16:35:54 EST 2013 | martingruber
I am facing the following problem: Powering up the machine the start sequence stops with following message: Inizializing Hardware .... Reading SRAM data .... Inizializing MEI Motion Bd .... Mei bd. @ 240 # Dev. Version 2.4g2 Option 41 DSP BOOT MEMORY
Electronics Forum | Tue Feb 28 17:45:56 EST 2012 | acsscott
So, got the Topaz X up and running. It has (4)FNC nozzles on 2, 4, 6, 8, and (4)74A Nozzles on 1, 3, 5, 7. We are trying to optimize it to pick up 8 components, then move over the camera, then to the PCB and place them. In the Mount data, we load
Electronics Forum | Thu Apr 07 20:16:23 EDT 2005 | davef
Q1) Simple way to measure the PCB warpage A1) IPC-TM-650; Method 2.4.22 Bow & Twist Q2) What is the maximum warpage can the SMT machine allow the to accept and place the component without problem. A2) That depends. IPC-A-610 Acceptability of Elect
Electronics Forum | Tue May 23 20:39:37 EDT 2000 | Dave F
Scott: Sounds like fun: � Solder joint strength in pull/shear varies with lead geometry, solder volume, lead metal/metallization, and the test method. � Among things, IPC-TM-650 talks to getting pads off-of boards. For instance: Method 2.4.8 is for
Electronics Forum | Sat Jun 19 11:44:00 EDT 1999 | Vic Lau
Do anyone have any experience on assembling high frequency product, 1.8GHz or 2.4GHz. In our production line, we manufacture 1.8GHz product with using no clean paste (RMA type) for reflow and no clean wire for rework. In our functinal test,either at
