Electronics Forum | Tue Mar 11 11:56:20 EST 2003 | Mark
Please inspect the pcb were the components were "lost" Check if the glue dots were lef on the PCB.If so you have a component which has been contaminated.If the dots dont appear on the PCB,which is the more common of the 2,there is an adhesion problem
Electronics Forum | Sat Jul 29 09:01:08 EDT 2006 | davef
Well, a "reflothermal recipe" is a typo. It should read "reflow thermal recipe". Sorry for the confusion. Most people call this THE PROFILE. We think a profile is the output of a profiler when it portrays the result of a reflow recipe. We're gue
Electronics Forum | Fri Oct 12 15:31:28 EDT 2007 | wayne123
I am needing to know if anybody uses a Reflow oven Chain oil that doesn't create a horrible smell. Whenever we put this oil on it burns off and smells like I am stuck at a stop light behind a car with bad rings. I have looked at several oils that adv
Electronics Forum | Thu Jul 15 04:33:56 EDT 2010 | jevans
We've recently purchased a second hand smt line which contains an Ersa Hotflow 9 reflow oven.We were informed that this oven was capable of handling a lead free process.The oven was manufactured in 2000,and it has come to our attention that it can on
Electronics Forum | Tue Nov 30 02:46:21 EST 2010 | libandara
We want to handle the materials such as PCB & MSD components as per IPC 1601 & J-STD-033. As such, we need a baking oven to perform this and to monitor (temperature – we have to maintain up to 200’C & humidity – below 5%)the control environment & ma
Electronics Forum | Fri Dec 03 04:11:47 EST 2010 | grahamcooper22
A baking oven over 100 C will be at zero humidity. Do you really need to store pcbs/devices at 200 C...this will surely harm some products ? IPC 33B01 allows storage of MSDs in a dry cabinet at less then 5%.....these can operate at room temp or 40 /
Electronics Forum | Sun Mar 15 08:48:53 EDT 2015 | davef
Sure, the formulation and purpose of a soldering flux and a socket cleaner are basically the same. Off the top of my head, differences are: * Activation temperature: soldering flux [~200*C], socket cleaner [~120*F] * Compatibility with some solder
Electronics Forum | Thu Apr 14 15:33:41 EDT 2022 | ppcbs
I've never lost memory in a BGA from heat removal. However we can create a profile on our BGA rework stations to remove using bottom heat only. This exposes the BGA body to temperatures of around 190 to 200C. I have a colleague that has a machine
Electronics Forum | Thu Nov 10 15:43:10 EST 2005 | 1st Article
myu, Is using a 0.6mm stencil wise? 42.5 X 42.5 has two models, the 1mm pitch has 41x41 array with 1657 I/O and the 1.27mm pitch has 33x33 with 1088 I/O. For a typical c-cga with 1.0mm - 1.27mm pitch, may requires a 2mil stencil, 1.0mm pitch gets .
Electronics Forum | Mon Oct 06 11:13:32 EDT 2003 | marmotzj
Dear All, I'm encountering a problem on mounting Intel E7501 and P64H2 FC-BGA chips. After the SMT process, these two BGAs were defected. Both had power-to-ground short circuits on the die package itself, and also the die resin had cracking tracks
