Electronics Forum | Tue Feb 03 12:39:20 EST 2004 | paul_bmc
We had the data at the time and it was quite high. More false calls then anything. I do not have the data anymore it since has been archived. When the system was introduced we had 1 engineer and 2 operators trained for programming and running the
Electronics Forum | Mon Jul 12 12:39:39 EDT 1999 | M Cox
| I need some advice concerning reflow of a BGA-292. Since I am not ready to change my entire process to no-clean, I decided to place the lone BGA-292 on a proto run using our BGA re-work station. The pcb is a moderately dense, single-sided, 8-laye
Electronics Forum | Tue Sep 11 22:40:26 EDT 2007 | philip_yam
We are testing SAC paste for thru-hole components in the 2nd reflow process. The solder joint is alright but some problem encountered in FR1 or CAM2 PCB after multiple times of reflow due to the temperature. We are very interested in Zn or Bi-based l
Electronics Forum | Wed Apr 16 10:26:27 EDT 2008 | tonyamenson
The problem is there wasn't any reflow when the board went through on the bottom side. Even if they didn't fall off becuase the temp was set low enough, while running the top side, the fact still remains that there wasn't reflow on the PCB pads to be
Electronics Forum | Wed Apr 16 09:25:55 EDT 2008 | hussman
Do you specify copper weight on your boards? This could be the difference between the the boards. Also the finish will be different between the boards as well. These two factors are enough to cause bottom side parts to reflow and fall off. In eit
Electronics Forum | Mon Apr 14 13:24:32 EDT 2008 | mmjm_1099
We had an order using a 2up PCB (same manufacturer) with same components and same board layout without any problems. Perfect run. The next order ran on the same day with same paste using same parts, same layout, same profile, but different 2up PCB h
Electronics Forum | Sat May 20 22:09:43 EDT 2006 | Ola
Interesting... We had visitors from (maybe out of space) that claims that the fumes!!! from whithin the reflow leadead solder process in an oven can get caught inside the oven during time and later on when we fire up the beast to the lead free temp-p
Electronics Forum | Thu Apr 17 05:14:40 EDT 2008 | gregoryyork
I have seen similar things like this before with Solder Resist redepositig back on the pads, this is a clear residue very hard to see. Solder resist will obviously resist solder adhering to it. If you rework the boards then the heat of the iron will
Electronics Forum | Wed Apr 16 09:02:09 EDT 2008 | tonyamenson
One issue stated incorrectly was that the work order that had no problems, with the same layout and same parts, is a one up at SMT. The problomatic units are two ups. I know the first instinct is to say the profile, but we have run this assembly man
Electronics Forum | Mon Mar 22 09:37:28 EST 2004 | ellis
After 2nd time reflow of double reflow, wrinkles solder joints found on SOIC and SOT components.(only happen on the components at the underside of pcb during reflow, top side components dont have this problem) is this due to the reflow process proble
