New SMT Equipment: aim (Page 4 of 260)

LV05 No Clean Flux Cored Solder Wire

LV05 No Clean Flux Cored Solder Wire

New Equipment | Solder Materials

LV05 no clean flux cored wire is designed for use in high throughput, high volume electronics assembly processes. LV05 demonstrates consistent, rapid wetting required for robotic and rework/hand soldering operations while leaving safe post-soldering

AIM Solder

NC No-Clean Tacky/Rework Solder Paste Flux

NC No-Clean Tacky/Rework Solder Paste Flux

New Equipment | Solder Materials

NC Paste Flux is a no clean tacky/rework flux designed to wet virtually all solderable electronic surfaces, components, assemblies, and substrates. AIM NC Paste Flux may be used for general touch up or rework of printed circuit boards, and for attach

AIM Solder

Solder paste

Solder paste

New Equipment | Solder Materials

AIM is a leading global manufacturer of tin-lead and lead-free solder paste and assembly materials for the electronics industry.

Production Automation Corporation

NC273LT Solder Paste For Bismuth Bearing Alloys

NC273LT Solder Paste For Bismuth Bearing Alloys

New Equipment | Solder Materials

AIM's NC273LT solder paste formula with bismuth containing alloys can provide an assembler with an innovative solution when temperature sensitivity is paramount. The revolutionary activator system in AIM's new NC273LT low temperature solder paste im

AIM Solder

Control Techniques - Emerson

Control Techniques - Emerson

New Equipment | Other

Variable speed AC and Vector drives, AC servo drives, DC drives for industry including specialized motors for replacing gear boxes on extruders. Call today for service or engineering support.

AIM Controls, LLC

Rich Electric Eric Drives

Rich Electric Eric Drives

New Equipment | Other

Variable frequency and Vector AC drives for all applications requiring speed and/or torque control. Call today for application assistance or support.

AIM Controls, LLC

Formosa Bumping Solder Paste

Formosa Bumping Solder Paste

New Equipment | Solder Materials

Bumping Solder Paste aims to decrease current issue of too much voids in the IC Packaging Manufactures. Our applications engineers of SMMI focus on developing the lower Void,

Shenmao Technology Inc.


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