Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/last-will-of-bga-void.pdf
. The LSLP reflow profile produced minimal voiding whereas the Extreme reflow profile resulted in voiding as large as 60% of the solderball diameter
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/04/last-will-of-bga-void-1.pdf
. The LSLP reflow profile produced minimal voiding whereas the Extreme reflow profile resulted in voiding as large as 60% of the solderball diameter
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PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/topic889&OB=DESC.html
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