Toddco3 Hotbar Bonding or Soldering System is a modular, floor standing bonder with a precision servo-driven rotary table. Compact overhead controls system with touch-screen display for easy operator acess is standard. Standard system software provid
Majelac Technologies provides subcontract assembly services to the semiconductor & optoelectronic industries. We specialize in Quick Turn Assembly & Packaging of Ball Grid Array packages and can handle a large variety of other package types.�Majela
Majelac Technologies provides subcontract assembly services to the semiconductor & optoelectronic industries. We specialize in Quick Turn Assembly & Packaging of Ball Grid Array packages and can handle a large variety of other package types.�Majela
Suitable for direct connection of solid. stranded or fine standed machine tool wire, as well as with crimped ferrules, pin terminals or tip bonded wire. All products designed in accordance with IEC60947, IEC60079, UL1059, UL486E, CSA C22.2 No.158 sta
The FINEPLACER® lambda is a flexible sub-micron bonder used for precise placement, die attach and advanced packaging. The system offers outstanding flexibility with a modular design and can be easily reconfigured for different applications. The syst
New Equipment | Solder Materials
AuSn solder electroplating is a key technology developed by Micralyne to lower your production costs and give you a better MEMS product. This state-of-the-art, patented process for electroplating AuSn solder alloy is a giant step forward in electropl
New Equipment | Test Equipment - Bond Testers
Nordson DAGE is the leading provider of award winning bond testing equipment. The second generation 4000Plus bondtester continues to be the most advanced bondtester on the market whilst the 4000 Optima is optimized for fast, accurate and reliable bon
New Equipment | Test Equipment - Bond Testers
Many bond strength tests require a means to grip the part so that the strength of its bond can be tested. In many of these applications the geometry and force of the grip must be precisely controlled to ensure sufficient load can be applied to the bo
Microelectronics and Semiconductor Inspection. MVP's 850G provides the highest accuracy flip-chip, die assembly inspection. Ensuring the correct placement of the die on the substrate, while providing edge, FM and surface inspection. The 850G modu
Tronixlink's Electronic Contract Manufacturing Service (EMS) PCBA layout Prototype builds Printed Circuit Board Assembly (PCBA) - Single sided , Double sided , Multilayer, Backplanes, Industrial Power boards, Wire Wrap boards, Fine-line , Analog ,
