Syagrus Systems has a long history in providing superior wafer and die visual inspection services to the semiconductor industry. Syagrus Systems features fully automated wafer inspection systems as well as the flexibility of manual wafer inspection
New Equipment | Test Equipment - Bond Testers
Nordson DAGE is the leading provider of award winning bond testing equipment. The second generation 4000Plus bondtester continues to be the most advanced bondtester on the market whilst the 4000 Optima is optimized for fast, accurate and reliable bon
Fast Automatic X-ray Measurement of TSVs, MEMS and Wafer Bumps for Voiding, Fill Level, Overlay & Other Critical Dimensions. Measuring the Invisible™ This new platform takes the market-leading capabilities from Nordson DAGE’s existing X-ray systems
Industry Directory | Equipment Dealer / Broker / Auctions
CMTec is highly specialized in dealing with assembly equipment. We support BESI (ESEC, Datacon), Kulicke & Soffa, Hesse & Knipps, F&K Delvotec, Orthodyne, ASM, Dage and others. CMTec delivers 'turn-key' projects worldwide.
Chip assembly? Classic SMT placement? Our SIPLACE CA can do both. The SIPLACE CA is the world's first placement platform that combines bare-die placement directly from the wafer and classic SMT placement in a single machine and a single production
Automatic, High Accuracy Desktop Wafer Inspection For semiconductor assemblies, the requirement for a precise, thorough inspection for damage and defects during the production process is especially high. Wafers need non-destructive inspection of sur
Industry News | 2017-03-14 22:49:33.0
We would like to check if you have 2 units of 2nd hand ESEC 2009 SSI or 2007 FS DA machines, below is the details; Please advise the delivery terms & lead time.
Industry News | 2016-06-13 15:22:10.0
Nordson DAGE, a division of Nordson Corporation announces the opening of their Asian clean room demonstration facility. Located south of Seoul, Republic of Korea, close to Incheon International Airport and in the heart of South Korea’s technology base, this 102 m2 clean room and conferencing center provides all of their regional customers with access to Nordson DAGE’s award-winning 4800 advanced automated wafer-level bondtester and XM8000 automatic wafer x-ray metrology tool.
Industry Directory | Distributor / Manufacturer / Manufacturer's Representative / Standards Setting / Certification / Training Provider
PB Technik supplies SMT equipment and materials to the Polish market. JUKI ERSA EKRA BRADY MARANTZ
Industry News | 2018-11-16 19:11:06.0
Nordson DAGE announces that it was awarded a 2018 Global Technology Award in the category of Test Equipment for its 4800 INTEGRA Automatic Wafer Bondtester. The 4800 is the complete solution for automated on wafer bond testing ensuring virtually operator free testing. It is specifically designed for advanced high-density interconnects in both front and back-end applications and utilizes recent advances in operator free technology. The Global Technology Awards recognize and celebrate innovation in electronics manufacturing. Premier products based on the finest examples of creative advancement in technology are chosen by a distinguished panel of industry experts and the Award was presented to the company during a ceremony that took place during SMTA International.
