Electronics Forum | Wed Jul 25 13:29:24 EDT 2007 | realchunks
Hi Lloyd, Homeplates will get rid of solder balling. They are only recommended "backwards" for 0402 or smaller (Points point away from each other). If you do this, you will have a full pad width of paste on the pad for the part to stick in. Obvio
Electronics Forum | Wed May 24 19:46:32 EDT 2006 | JohnM
So, it looks like the backward compatible of BGA statement is not guarantee for solder joint reliability. It doesn�t matter what temperature and what melting sequence we have in order to avoid the solder void issue. Is Pb diffused homogeneously thr
Electronics Forum | Mon Jul 16 10:51:09 EDT 2007 | patrickbruneel
D. Hillman, et al., �The Impact of Reflowing a Pb free Solder Alloy Using a Tin/Lead Solder Alloy Reflow Profile on Solder Joint Integrity,� International Conference on Lead-free Soldering, CMAP, Toronto, Ontario, Canada, May 24-26, 2005, http://www.
Electronics Forum | Fri Dec 16 19:48:16 EST 2005 | Ola
Mika has a point here. AMD has some RoHS compliant components that are Not backwards compatible, in terms of leaded soldering paste & reflow temperature! They are Not willing to tell You Why! I think it has to do with something like: http://www.webel
Electronics Forum | Thu Sep 11 10:45:41 EDT 2008 | diesel_1t
Is just me, or too many "soldering issues" have been observed lately? on this forum... could be a ~90% components "backwards/compatible" in both leaded/lead free process?
Electronics Forum | Wed Jul 06 03:23:14 EDT 2005 | javi
We start to get mixed component leaded and lead-free, we still using leaded solder paste in the SMT process. Do you see this a problem to use leaded process 179 deg celsuis temperature reflow on RoHS compatible lead-free components with same specific
Electronics Forum | Wed Jul 06 04:38:43 EDT 2005 | javi
AJ, Thanks for your input, forgot to inform that there is none BGA on the PCB. I also discovered that there was another topic related mixed component that give me support enough. Will inform my supplier to perform the process in the SMT line and not
Electronics Forum | Wed Apr 14 13:39:08 EDT 2021 | SMTA-64387124
I am working with a CM in Taiwan and we are seeing significant differences between the paste printing bon the forward stroke vs the backward stroke. Print parameters are the same (pressure, speed, snap off speed) but there is a significant difference
Electronics Forum | Wed Sep 20 19:43:35 EDT 2000 | David Harper
We have the very same problem.. In our next job our assemblers will be placing 2 million PTH LEDs. Fortunately we get all out LED's from the same manufacturer and hope they come in bags. If not we gotta cut them off the tape.. and well... that just m
Electronics Forum | Wed Sep 20 19:44:04 EDT 2000 | David Harper
We have the very same problem.. In our next job our assemblers will be placing 2 million PTH LEDs. Fortunately we get all out LED's from the same manufacturer and hope they come in bags. If not we gotta cut them off the tape.. and well... that just m
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