Electronics Forum | Mon Jun 28 14:48:56 EDT 2004 | jdumont
Yes i was looking around that site this morning and found everything i needed. Thanks to all. Basically what im trying to do is justify the expenditure of a new NO2 generator for our IC cabinets. Ours died a little while back and we have been using
Electronics Forum | Mon Jun 28 10:02:06 EDT 2004 | fmonette
The answer is yes, it is possibly a moisture-related problem. You can confirm this by baking your parts at 125C for 48 hours (ref. J-STD-033A, table 4-1). For more technical background on this issue I recommend you read the following paper : Impac
Electronics Forum | Mon Jun 28 14:30:46 EDT 2004 | davef
There multiple potental causes of BGA curling during reflow. One of them is moisture inclusion in the part, as Francois mentiones above in this thread. Another has to do with the construction of a BGA. So, from our perspective, more often the mois
Electronics Forum | Sat Jan 19 02:29:11 EST 2002 | ianchan
Thanks for the tips... found out the ex-employee guy, had pre-bake conditioning put into the process flow, as this pcb is made of polymide material, that is reputed to have historical patterns in thermal sensitivity. To avoid "thermal damaging" the
Electronics Forum | Fri Jan 18 04:45:32 EST 2002 | wbu
Ianchan, baking as being part of pre-heating is obviously sensless cause the PCB will not maintain any of that heat till soldering. Common reason for prebaking PCB�s is getting the moisture out to prevent outgassing, warpage and maybe other defects.
Electronics Forum | Mon Apr 19 17:44:43 EDT 1999 | Chrys Shea
| | While trying to sell me a low temperature baking system for SMDs the salesman mentioned that the 125C for 24hr bake had been known to cause co-planarity defects. | | I thought I'd ask some experts. Any help guys? | | | Gerry: I imagine there co
Electronics Forum | Fri Apr 16 19:52:39 EDT 1999 | Scott McKee
| While trying to sell me a low temperature baking system for SMDs the salesman mentioned that the 125C for 24hr bake had been known to cause co-planarity defects. | I thought I'd ask some experts. Any help guys? | Let me get this straight... He's
Electronics Forum | Sat Sep 26 22:08:07 EDT 1998 | Jeff Sanchez
I recieved a pack of sensitive IC's that said they needed to be baked befor certain processes. If I need to do rework, do I have to bake prior to single soldering of these IC's. Or can I just place one as needed by hand with out baking? Any info woul
Electronics Forum | Fri Jan 05 20:12:22 EST 2007 | engr
I am using PWB material Rogers 6002 High Frequency Laminate. The PWBs are assembled. They were washed and will require a bake out. Some people say, no bake out is required for the material. I am getting different reads in test if the CCAs are not
Electronics Forum | Mon Sep 28 08:35:15 EDT 1998 | Earl Moon
| I recieved a pack of sensitive IC's that said they needed to be baked befor certain processes. If I need to do rework, do I have to bake prior to single soldering of these IC's. Or can I just place one as needed by hand with out baking? Any info
