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and Inspection systems - Hall 4A - Stand 214 Use of Digital X-ray Imaging as a Process Control for Lead Free PWA Assembly Nordson DAGE Correlating the Presence of Popcorned BGA Devices Post Reflow
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ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/asymtek/industries/electronics-assembly-and-packaging?con=t&page=2
"Precise, high throughput dispensing of thermal interface material in BGA packaging applications" Nordson ASYMTEK’S New Quantum System Delivers Fluid Dispensing Refinement in a Large-Format Dispensing Platform Nordson ASYMTEK Accommodates wide range of substrate sizes, fluids, and processes for SMT, PCB packaging
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. This underfill process is being used in production for chip-on-wafer and chip-on-BGA packaging. In one example, underfill must be dispensed within 300-500um KOZ of 2-5 mm2 size die at 4000 UPH
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Reflow ovens for automated SMT PCB assembly, specializing in lead free processing and nitrogen reflow. The best convection reflow ovens on the market.
4 Vreeland Rd.
Florham Park, NJ USA
Phone: 973-377-6800
