Industry News: bonding thermocouple to board for profiling (Page 4 of 10)

KIC’s Brian O’Leary to Host Upcoming Webinar on Profiling BGAs

Industry News | 2009-06-23 20:11:42.0

San Diego — June 2009 — KIC, the leader of thermal process development and control products, and winner of multiple industry awards, announces that Brian O’Leary, Sales Manager – Americas, will host a free Webinar on June 26, 2009 at 1 p.m. PST. The topic of the Webinar will focus on providing solutions to common thermal process and profiling issues.

KIC Thermal

KIC to showcase new integrated fixture and profiler designed for tracking reflow oven stability at NEPCON Asia

Industry News | 2019-08-08 08:16:10.0

KIC today announced plans to exhibit in Booth 1C01 at NEPCON Asia, scheduled to take place Aug 28-30, 2019 at the Shenzhen Convention and Exhibition Center. Company representatives will showcase the new SRA (Smart Reflow Analyzer) and RPI i4.0

KIC Thermal

KIC to Present During SMTA Houston Expo & Tech Forum

Industry News | 2010-02-12 09:55:13.0

San Diego — February 2010 — KIC, the leader of thermal process development and control products, and winner of multiple industry awards, announces that Brian O’Leary, its Americas Sales Manager, will present “How to profile complex PCBs: creating offsets, balancing your board and nondestructive profiling strategies” at 10:30 a.m. at the upcoming SMTA Houston Expo and Tech Forum, scheduled to take place Thursday, March 4, 2010 at the Stafford Centre in Stafford, TX.

KIC Thermal

Innovations for FINEPLACER® lambda to be highlighted at Productronica 2011

Industry News | 2011-09-06 14:29:23.0

At Productronica 2011, Finetech will present a number of smart improvements and new options for the FINEPLACER® lambda.

Finetech

Nordson DAGE to Bring Solutions for Live Imaging and Demanding Applications to SMT/Hybrid/Packaging

Industry News | 2013-03-20 10:54:36.0

Nordson DAGE, announces it will exhibit in Booth # 7-224 at the SMT/Hybrid/Packaging 2013 exhibition and conference, scheduled to take place April 16-18, 2013 at the Messezentrum in Nuremberg, Germany.

Nordson DAGE

One Minute to Understand AXI and Utilize It for Free

Industry News | 2019-08-15 07:31:59.0

AXI is short for automated X-ray inspection, it's one of the most commonly used approaches for defect inspection in PCB Assembly.

Elecrow

Datapaq Surveyor to be showcased at IPC/APEX 2008

Industry News | 2008-02-28 14:52:50.0

January 2008 � The Datapaq Surveyor will be showcased at the 2008 IPC/APEX tradeshow in booth #1438. The Surveyor provides and easy and accurate way to monitor the thermal performance of your reflow oven every hour, day and shift - effortlessly.

Datapaq, Inc.

Fred Dimock to Present Solder Reflow Fundamentals Tutorial at SMTAI

Industry News | 2014-08-28 12:24:16.0

BTU International, Inc. , today announced that Fred Dimock will present a tutorial during SMTA International.

BTU International

Prima Electronic Services Switches to iineo for High-Complexity Boards.

Industry News | 2020-03-19 13:05:40.0

Prima Electronic Services, has chosen to underpin its growth plans by selecting Europlacer's iineo+ placement platform to address larger and more complex customer boards. The decision to switch to Europlacer is notable as the company has long been a Yamaha customer; it has seven iPulse machines already operating on its assembly lines.

EUROPLACER

KIC’s Brian O’Leary to Present during IPC’s Summer School Series of Webinars

Industry News | 2010-06-16 11:06:03.0

San Diego, CA — KIC, the leader of thermal process development and control products, and winner of multiple industry awards, announces that Brian O’Leary, Sales Manager – Americas, will host a Webinar as part of the IPC ― Association Connecting Electronics Industries®’ Summer School Series. The series is expected to reach a global audience of more than 40,000 contacts.

KIC Thermal


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