Electronics Forum | Fri Mar 04 00:46:36 EST 2011 | kemasta
Hi ScottE "Is this ball sitting on a via?" I am not sure is I answered your question correct, the ball is sit on the pad.
Electronics Forum | Thu Mar 03 02:00:37 EST 2011 | kemasta
I tried, but error:- Attribute validation error for tag CFFILE. The value of the attribute destination, which is currently /var/www/smtnet/Forums/Attachments//, is invalid. The error occurred on line 12. Try go to this url and view:- http://img845.
Electronics Forum | Sun Oct 08 00:18:05 EDT 2000 | Arturo
We are working with a 16mil TSOP Land width=0.2mm(8mil) and use: 1.Type 4 particle size solder paste. 2.Laser cut electropolished stencil: Aperture width=0.19mm (we tried lower than this but had solder insufficiency). Thickness=0.005"(130 microns)
Electronics Forum | Mon Mar 21 02:54:58 EDT 2011 | kemasta
Hi Dave I agree with the 2nd point (sloppy process management) if the failure rate is higher than 5%. But this is 0.083% case, and only happen once in the blue moon. As I study about the re-flow profile for the last whole week, current parameter se
Electronics Forum | Tue Oct 10 20:14:01 EDT 2000 | Dason C
Hi! CJ. Please advise what is your pitch size ie 15.7 mil or what is your capabiliy can you build the board with pitch 15.75 mil (please note that the actual dimension of the package is 0.4mm), and how many lead on the package. The pad width of Ind
Electronics Forum | Tue Jun 08 08:40:37 EDT 1999 | Wister
Hi,my master How to iron out such soldering bridge with below conditions: 1.The component(Harness)lead pitch is 2.0mm,the lead length is 3.2mm. 2.PCB width is 1.6mm.Pad size is 1.65mm.Its a single copper PCB 3.using spraying fluxer and no-clean fl
Electronics Forum | Tue Jun 08 08:38:15 EDT 1999 | Wister
Hi,my master How to iron out such soldering bridge with below conditions: 1.The component(Harness)lead pitch is 2.0mm,the lead length is 3.2mm. 2.PCB width is 1.6mm.Pad size is 1.65mm.Its a single copper PCB 3.using spraying fluxer and no-clean fl
Electronics Forum | Thu Nov 17 03:34:51 EST 2005 | cangly
Hi, We have a board with over 100 chips (mixed size) and some long Connector DIP through out Wave solder with many issues of no solder and solder bridge, (using clean flux with bubble fluxer and Kester solder bar). Currently we tried to reduce the de
Electronics Forum | Thu Nov 17 13:13:49 EST 2005 | Mike
Hello, Some questions.... Are you running lead free? What alloy? What�s your pot temp at? Temp of the board after preheat? Are you getting any solder in the barrels (
Electronics Forum | Thu Nov 17 20:23:14 EST 2005 | cangly
Hi Russ, We control the gravity of flux each 8 hours and will mix thinner to balance it if any.. Do we need more any action for this.. Thanks for your advices.
