Electronics Forum | Wed Feb 01 12:57:51 EST 2006 | wheels_in_the_well
There are several makes of stencil cleaning equipment. The previous post mentioned, Aqueous Tech (www.aqueoustech.com). Others of long standing high reputation are EMC Global (www.emcgti.com), Austin American Technology (www.aat-corp.com), and Tech
Electronics Forum | Fri Feb 04 09:23:21 EST 2000 | Casimir Budzinski
If No-Clean flux does not need to be cleaned, then why do I get readings of up to 27(ug NaCl/sq in) on boards that are not washed, up to 23.4(ug NaCl/sq in) on boards washed with DI water only and from 1.2 to 10.1(ug NaCl/sq in) on boards washed with
Electronics Forum | Wed Mar 24 15:15:35 EST 2004 | davef
I think you can effectively clean under any other low standoff device. It's an issue of surface tension, pressure, and flow rate. DI water is the starting point, but the surface tension of straight DI water makes it difficult to get under low stand
Electronics Forum | Mon Apr 14 15:37:00 EDT 2014 | jdenuzzia
If you do a search on Reflow Oven Cleaning Fluid, you will find links to companies and chemicals that can assist you. I recommend that you contact one or more of the companies and discuss your needs and the paste you are using. They should be able t
Electronics Forum | Thu Apr 22 10:43:25 EDT 2004 | tigerlordgm
We had a great deal of trouble cleaning adhesive residue from stencils using an alcohol stencil washer. Same kind of thing, adhesive build-up in aperture corners. The solution we came up with was to convert our stencil washer to run Zestron ES200, a
Electronics Forum | Mon Aug 31 12:37:39 EDT 2009 | rocko
Hi All, As a result of equipment damage I have a problem with a cleanliness of printed circuit assemblies. One whole production batch was polluted by ionic residues because a large amount of hard water had been penetrated in the water-supply system
Electronics Forum | Thu Jun 01 21:54:00 EDT 2000 | Dave F
Jeremy: Standards: � A-600 talks about percentage of solder mask loss allowed, according to the location (eg, laminate, bare copper, gold or nickel, melting metals) and equipment class. � A-610 talks to "Solder Resist Coating - Voids & Blisters" by
Electronics Forum | Tue Nov 27 19:42:58 EST 2001 | mparker
Dave - will placing MELF's in SMT eliminate the original problem? Is the flux aggressive enough to clean mold release agents from the component manufacturer? Good point about LT reliability, just wondering what would happen if glue was eliminated fr
Electronics Forum | Thu Mar 21 09:23:35 EDT 2024 | alishakihn
Good morning! I'm sorry to hear about the anomalies you're experiencing with your inline wash. Dealing with foaming issues can be challenging, but I'll do my best to provide some suggestions to help you troubleshoot the problem. 1. Check the Water Q
Electronics Forum | Tue Mar 30 22:30:06 EST 2004 | davef
Tony First, drying at 125*C for an hour is not going to do much drying. Heck, those boards are barely warm to the touch. Second, tell us about: * Pitch of your uBGA * Solder paste flux * Cleaning process and agents
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