Full Site - : coat wicking (Page 4 of 5)

Re: HELP!! via sizes, location

Electronics Forum | Tue Oct 05 12:42:43 EDT 1999 | Chris May

| I am a new employee at a company that has had a large turnover of employees over the past year. I am working on a board (components on one side only), the engineer (he is also new ) wants to use an .035 pad with a .021 dia. hole, there are no via's

BGA Via Plugging

Electronics Forum | Thu Feb 07 20:53:51 EST 2002 | davef

Regardless of the technique used for the mounting pad shape or definition, isolation of the plated through hole [PTH] from the mounting pad is important. If the PTH is contained within the mounting pad, solder will wick down the PTH. The amount of

No-Lead solder defect - No solder on pads

Electronics Forum | Fri Dec 12 11:52:59 EST 2003 | Marc Simmel

I have encountered problems with a 90/10 tin-lead plated SMT component wicking all the solder paste off the pads on the substrate. Worst, the defect occurs randomly - adjacent leads may have 'good' joints, though heel fillets are poor. The solder pa

Palladium poor wetting

Electronics Forum | Mon May 22 18:19:29 EDT 2006 | Steve

I have read some threads about poor wetting on palladium-silver (Pd-Ag) coated components. I followed the suggestions, but I am still having a problem. The part is an 0603 chip type (Vishay varistor). The Process: solder paste is lead-free Alpha Met

CF CARD issue

Electronics Forum | Sat Aug 11 05:29:31 EDT 2007 | johnz

We are having a problem with JST connector ICM-MA50H-SS52-1161 LF SN. After reflow oven soldering we have mostly problem with soldering quality for firs or last leg of the connector. (There is no connection- leg just lays-lift on the solder no wicki

Need advise on regarding Vias

Electronics Forum | Mon Dec 13 00:48:33 EST 1999 | armin

Hi All I have a 0.7 mm diameter hole for vias, what�s the minimum annular ring for this hole diameter? What�s the term unsupported and supported holes refer to in IPC-2221 9.1.2 Annular Ring Requirements? I have a proto-type PCB (designed by our R&

Re: BGA Repair Problems

Electronics Forum | Mon Aug 17 02:50:44 EDT 1998 | Bob Willis

| Have an SRT w/preheat, 18 layer board all copper, 456 BGA needs to be removed and replaced. The manufacturer is Chip Express and during reflow it warps up or down. Causing either opens or shorts on the corners. I was using gel flux with multiple


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