Electronics Forum: common and battery (Page 4 of 12)

Panasonic MV2C pick and place.

Electronics Forum | Tue Feb 23 02:43:37 EST 2021 | gabriel1blue

We just came out with a new problem with these machines. We had to shutdown for a a few weeks due to Covid-19 and now they have errors when we start them up. Looks like the back up batteries died and after we replaced all of them the settings are com

Panasonic MV2C pick and place.

Electronics Forum | Thu May 21 18:11:37 EDT 2020 | gabriel1blue

Thank you for your reply. I tried to contact Panasonic support but even them have a hard time getting information on this machines. I have been waiting for them to let me know if they help us but no luck yet. I did replaced the a few backup batteries

CSP and BGA soldering difference.

Electronics Forum | Fri Apr 06 09:45:08 EDT 2007 | pjc

CSP= Chip Scale Package, meaning small. A MicoBGA is a CSP, while a regular BGA is not a CSP. CSPs require fewer steps to fabricate than standard BGAs. A commonly quoted definition of a CSP is a package where the body size is

Solder Splash/Balls and Flux Splash/Balls

Electronics Forum | Fri Dec 11 08:56:08 EST 2020 | SMTA-64304223

One of the common causes of solder ballin is also outgassing from the boards have your tested the board for outgassing? Bob Willis

tape splicing pros and cons

Electronics Forum | Fri Sep 23 10:25:40 EDT 2005 | gregp

On our machines, the feeder release latch is designed such that the feeder goes offline (machine will not pick from it) before you can actually remove the feeder. This makes it virtually impossible to damage a nozzle or spindle. I'm not sure about

Re: Geometric Dimensioning and Tolerancing

Electronics Forum | Sat Jun 06 22:53:11 EDT 1998 | EFData

Earl, As always, I am interested in what you have to say, but I am still a little vague on your application of ANSI Y14.5 as it relates to the manufacturability of an assembled printed circuit board. Are you implying that component placement coordina

Palladium finish and solder balls

Electronics Forum | Thu Jun 27 21:28:42 EDT 2002 | davef

You're correct that the Ni/Pd termination seems to have something to do with you solder balling. It could be related to the interaction between your paste and the Pd. I assume these are really 'fines' rather than 'balls'. Things that come to mind a

0402 Components and Solder Paste

Electronics Forum | Thu Jul 20 14:05:59 EDT 2000 | Mike McMonagle

With 0402 components becoming more common today outside of the telecommunications industry, our company is qualifying equipment and processes for an upcoming product incorporating 0402s. Having used 0402s in a previous position, I am planning a DOE o

Via holes and Wave Solder

Electronics Forum | Tue Mar 07 21:35:16 EST 2006 | Cal Kolokoy

Samir, From experience, the only board test situation where tented via's have difficulty with contact is with a Flying Probe type tester. Otherwise, for traditional ICT, the force of the pogo pins, correct probe type, and fixture design should do th

Mixing conformal coating and RTV

Electronics Forum | Fri Apr 22 10:12:14 EDT 2005 | davef

Common RTV does out-gas causing corrosion. NASA allows use of non/low-out-gassing RTV. Try the following companies: * Ablestik Electronic: Materials, 20021 Susana Road, Rancho Dominguez, California 90221 U.S.A., 310-764.4600, F 310-764-2545 * Arlon


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