Electronics Forum | Sat Jul 25 00:09:13 EDT 1998 | Phillip Hunter
Use caution if epoxy is dispensed under the PLCC 84. If the "SMT Gods" look unfavorably onto you rework will be difficult. I had a ceramic PLCC 84 which weighed 15 grams (MCM) and due to packaging failures (glass seal to metal cover) rework was the
Electronics Forum | Thu Aug 24 23:20:22 EDT 2017 | micropak
We often do double sided SMT assembly, never had issues with smaller components. However, we apply glue to heavier components like inductors, SD card sockets etc. For this purpose, we have a glue dispensing machine inline after the solder paste prin
Electronics Forum | Tue Apr 10 14:35:52 EDT 2007 | UT
We are in middle to prototyping a lead free assembly for one of our customers. We are using lead free bare PCBs, consumables and components, except for two ICs which are leaded per the customer BOM. Will the overall assembly be defined as lead free p
Electronics Forum | Thu Oct 03 09:53:08 EDT 2002 | Jim Gryga
I am looking for a software package that can provide me with a ballpark estimate of labor time required to assemble electro-mechanical products. The inputs that I imagine would include number and size of fasteners, number of wire connections, number
Electronics Forum | Fri Jul 15 13:58:32 EDT 2005 | seaK
Our production is putting QFN40 and QFN56 package on board. With 80% opening on terminal, 40% on thermal pad, we found QFN56 100% forming toe fillet, but it does not work out the same to QFN40. We suspect it's because of the weight of component.....
Electronics Forum | Mon Aug 09 08:16:44 EDT 2010 | markhoch
It will most likely hold on. There is a formula that you can use if you're uncertain. It's (weight of the component in grams)/(total pad mating area in square inches) Grams per square inch must be less than or equal to 35 for the component to be mo
Electronics Forum | Mon Jul 27 03:20:42 EDT 1998 | Frank J. de Klein
Dear Dave, Sure we can ! There are two values going around. One is 50 mg/mm2 The other one is 30 g/inch2 (30 * 1000) / (25.4 * 25.4) = 46.5 mg/mm2 So we are talking the same language. Regards, Frank J. de Klein | | | Hi, | | | We have encountered one
Electronics Forum | Thu Jun 23 10:43:40 EDT 2005 | davef
It wouldn't surprise us [too much] if this part wouldn't stay for second sided reflow. * If the lead contact area to weight is less than 44 gm / inch^2 [we know the units are goofy, but convient], it'll stay. * Alternately, just run a scrap board a
Electronics Forum | Thu Aug 13 10:58:58 EDT 2009 | davef
First piece of advice: build the board as you would any other board. Probably, you will be surprised at the holding force of the solder of the connections of the BGA, because the surface area of the solder is very large compared to the weight of the
Electronics Forum | Mon Dec 16 09:59:57 EST 2002 | blnorman
We had the same problem and solution with one of our components on one of our lines. Don't know for sure what the "weight" was that they used, but it did solve the problem. Since then the same line is looking a putting an adhesive on the part to ho
