Electronics Forum: components per hour (Page 4 of 114)

Re: Cost per placement measure

Electronics Forum | Tue Oct 05 01:22:46 EDT 1999 | Karlin

| I am working on trying to define a cost per placement measure in our SMT assembly operations. | | Does anyone know where I might find a published industry average that we may compare to? | | I�ve heard it stated that an industry average is less t

Number of thermal excursions per componet

Electronics Forum | Wed Jun 27 21:05:48 EDT 2001 | davef

BGA Cycle 1: solder ball attach. BGA Cycle 2: BGA attach to board. BGA Cycle 3: BGA removal from board. BGA Cycle 4: BGA pad dress. BGA Cycle 5: BGA ball replacement. BGA Cycle 6: BGA re-attach to board. Board Cycle 1: BGA attach to board. Boar

placement of 8 ml smt components

Electronics Forum | Thu Sep 10 12:32:31 EDT 1998 | Tim Scully

Heeeelllllp. I am a sales rep. ( I know I know, you can't help me with that. ha ha.) Actually, I represent a company that fabricates PCBs and assembles them under the same roof. We are a small to moderate volume house that is just getting into su

Re: placement of 8 ml smt components

Electronics Forum | Fri Sep 11 09:30:30 EDT 1998 | Earl Moon

| Heeeelllllp. | I am a sales rep. ( I know I know, you can't help me with that. ha ha.) Actually, I represent a company that fabricates PCBs and assembles them under the same roof. We are a small to moderate volume house that is just getting int

Re: placement of 8 ml smt components

Electronics Forum | Thu Sep 10 15:29:15 EDT 1998 | matthew park

Tim, What is it? Which ones are you talking about: 0.080" vs 0.008", 0.100" vs 0.010", or 0.050" vs 0.005" pitch devices . If you are saying 0.080",0.100" and 0.050", any pick and place machine can handle that. Well if not, one machine that is ca

Re: SMD reeled components

Electronics Forum | Tue Feb 15 13:47:59 EST 2000 | Stu Leech

We have just completed a test for a leading manufacturer of SMT IC packages. There were some surprises. The carrier and cover tapes appear to be highly hygoscopic. The saturation curves for the tape and devices showed dramatic absorption at the begin

Baking components at 70 degree

Electronics Forum | Wed Jun 25 12:48:51 EDT 2008 | sleech

I would love to see the documentation of the experiment that indicated that a 24-hour/70 degree C bakeiing cycle at 10Pa is more effetive than a 24-hour 125 deg C baking cycle at normal atmosphere. We have looked at the old Levey-Perlmann paper and f

Baking components at 70 degree

Electronics Forum | Tue Jun 17 04:46:59 EDT 2008 | fowlerchang

Vacuum baking oven can solve it. At 70 degree and 24 hours. And the vacuum is below than 10pa

Baking components at 70 degree

Electronics Forum | Tue Jun 24 21:01:27 EDT 2008 | fowlerchang

Qulification the baking process of 70 degree and 24 hours below 10Pa. We have the experiment data which shows the weight of baked water from package with this condition is more than 125 degree at normal condition.

Baking components at 70 degree

Electronics Forum | Wed Jun 25 08:06:04 EDT 2008 | davef

Questions are: * What does "weight of baked water from package with this condition [70 degree and 24 hours below 10Pa] is more than 125 degree at normal condition" mean? * What is "normal condition"?


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