Industry News | 2003-06-26 09:02:38.0
The surface quality of printed circuit boards and components directly impacts performance and product life.
Industry News | 2003-03-25 08:31:07.0
On completion of the transaction, Flairis will become a wholly-owned subsidiary of Beyonics and its shares will be delisted from Sesdaq.
Industry News | 2011-12-14 16:19:46.0
MIRTEC announces that ACD purchased two Mv-7xi In-Line AOI Systems during the recent Productronica Trade Fair in Germany. ACD has very high inspection standards and the new MV-7xi AOI systems will help the company continue to meet or exceed those requirements.
Industry News | 2020-03-25 12:00:41.0
After an extensive evaluation BOSCH has selected MIRTEC's 3D AOI Technology as the best solution to meet their ongoing quality initiatives.
Industry News | 2013-04-04 11:07:31.0
MIRTEC announces that it has been chosen as the exclusive AOI partner for Bosch for the next five years.
ProntoVIEW-MARKUP is assembly CAD Viewer & Gerber Viewer software used by electronics manufacturers to quickly find components, pin, shorts between traces, etc. ProntoVIEW-MARKUP is also a redline tool that allows annotation of the assembly to creat
New Equipment | Board Handling - Conveyors
Product introduction: 1.Steel frame, static painted surface; 2.Balance weight design improve the stability; 3.Reject,inspection,pass,three mode optional; 4.Smooth and parallel width adjustment(leadscrew); 5.According the customer’s damand to c
Product introduction: 1.Steel frame, static painted surface; 2.Balance weight design improve the stability; 3.Reject,inspection,pass,three mode optional; 4.Smooth and parallel width adjustment(leadscrew); 5.According the customer’s damand to c
Technical Library | 2019-06-07 14:49:54.0
ACI Technologies was contacted in regards to poor solder joint reliability. The customer submitted an assembly that was exhibiting intermittent opens at multiple locations on a ball grid array (BGA) component. The assembly’s functionality did not survive international shipping, essentially shock and vibration failures, immediately making the quality of the solder joints suspect. The customer was asked about the contract manufacturer and the reflow oven profile as well as the solder paste and surface finish used. The ACI engineering staff evaluated the contract manufacturer’s technique and determined that they were competent in the methods they used for placing thermocouples in the proper locations and developing the reflow oven profile. The surface finish was unusual, but not unheard of, in that it was hard gold over hard nickel, rather than electroless nickel immersion gold (ENIG). The customer was able to supply boundary scan testing data which showed a diagonal row of troublesome BGA pins.
