Electronics Forum: copper and pcb and contamination (Page 4 of 8)

Reflow soldering problems and traces under component

Electronics Forum | Mon Jul 18 12:25:30 EDT 2016 | oleksz

Some people involved in PCB assembly process claim that SMD components reflow soldering problems are often caused by traces running under a component. According to this claim, trace (or any copper) covered by solder mask and placed under SMD componen

force between the pad and laminate material

Electronics Forum | Tue Jun 11 22:06:06 EDT 2002 | scottxiao

I encounter the problem, it is easy for pad(copper) to drop off from the PCB, which is Ni/Au finish. so my question is whether there is any specification about the force between pad and laminate material, and does the PCB corpoartion test this parame

Percentage of Blowholes and Pinholes can eliminate.

Electronics Forum | Thu Oct 17 05:16:44 EDT 2013 | vincentdesilva2003

Anyone can help me how many percentage of blowholes and pinholes if i do the followings: 1. Increase copper plating thickness more than 25 microns. 2. Pre Baking of PCB to remove gassing by drying out the PCB's

Board change and solder not adhereing completely

Electronics Forum | Fri Apr 06 08:28:34 EDT 2001 | CAL

From what you are saying................If I hear ya correctly - There is no "Protective" on the Pads (OSP, HASL....) You will be hard pressed soldering to bare copper. This can not be right. My suggestion- go polyamide with electroptical connectio

Board change and solder not adhereing completely

Electronics Forum | Fri Apr 06 08:27:09 EDT 2001 | CAL

From what you are saying................If I hear ya correctly - There is no "Proctective" on the Pads (OSP, HASL....) You will be hard pressed soldering to bare copper. This can not be right. My suggestion- go polyimide with electroptical connecti

Your opinion about RoHS and WEEE ?

Electronics Forum | Wed Dec 15 15:24:22 EST 2004 | russ

I think they need to go after the real lead contaminants. PCB/electronic waste accounts for .01% of lead waste based upon my last info I rec'd. So this lead free agenda is really going to help alot isn't it. I believe that most of the lead contami

Board change and solder not adhereing completely

Electronics Forum | Fri Apr 06 04:10:25 EDT 2001 | kensmoke

We recently had a multi block panal change at the vendor Now the production lines are producing solderability defects in great number. The makeup of the pcb is a type of fiber glass mask green in color and pads with no tinning just copper lands.

Re: Green coating and through-hole plating

Electronics Forum | Thu Aug 13 12:55:46 EDT 1998 | Dave F

| Hi, can you please tell me how to make green coating and through-hole plating of PCB? Thanks! | Xingsheng Xingsheng: Welcome. Bible on PCB fabrication: Printed Circuits Handbook, Clyde Coombs, McGraw-Hill Web resources: http://www.pwbrc.org/ a

Re: Relationship between BGA and PCB substrate

Electronics Forum | Thu Dec 10 09:09:31 EST 1998 | Earl Moon

| Hi everybody? | I heard that typical FR-4 would not acceptable for BGA application. | What is the main reason? | (thermal property? or CTE?) | Sombody please answer me the requirement of PCB substrate for PCB application. | Thanks. | | Youngho Son

Re: Green coating and through-hole plating

Electronics Forum | Fri Aug 14 07:27:42 EDT 1998 | Earl Moon

| | Hi, can you please tell me how to make green coating and through-hole plating of PCB? Thanks! | | Xingsheng | Xingsheng: Welcome. | Bible on PCB fabrication: Printed Circuits Handbook, Clyde Coombs, McGraw-Hill | Web resources: http://www.pw


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