Electronics Forum: copper surface (Page 4 of 39)

1oz Copper Sheet Specifications

Electronics Forum | Tue Dec 09 18:03:39 EST 2008 | davef

First, you cannot determine foil thickness from its weight per area, because there is significant variation in the density of electrodeposited copper. Second, the official IPC specification for minimum thickness is "after" processing by the fabricat

Cleaning Copper Surface

Electronics Forum | Thu Apr 15 20:01:24 EDT 2010 | sarason

I normally use a particularly aggressive Hand Cleaner for cleaning oil off your hands at garages/ workshops and then Benzotriazole. The Hand cleaner comes from an industrial chemical supplier. It usually contains some NaOH while most Hand-cleaners do

ENiG or IAg? Which is better?

Electronics Forum | Sat Mar 15 09:30:29 EDT 2008 | davef

Unlike other solderability protection, immersion coatings [eg, ImAg, ImSn, OSP, etc] can be reworked by the board fabricator prior to assembly operations. Reasons for selecting immersion are: * Until a supplier can demonstrate that they can turn bla

Fiducials

Electronics Forum | Thu Feb 18 12:56:18 EST 1999 | Bob Barr

We are using .040" diameter fiducials (global and local) on our boards. They are solder covered and HASL. I get batches of boards where the p&p vision system has trouble reading the fiducial. The fiducial looks dark on the screen. The board vendo

Cleaning Copper Surface

Electronics Forum | Thu Apr 15 20:07:38 EDT 2010 | userrich

"BiRAL SC" is a water displacing cleaner. - effective for cleaning most metals including carbon- and stainless steel, copper, aluminium etc. - cleans electrical motors, brush holders, bearings, armatures etc, - cleans and treats most types of plastic

Question of delamination in PCB

Electronics Forum | Fri May 01 07:22:56 EDT 2009 | kareal

In my project of flip chip PGA production , I found serious delamination in interface of solder mask and first layer copper trace of substrate after UHAST 96hrs( 130C, 85%RH) reliability test. The delamination are always around one type solder bump,

Re: Suspected Pink Ring

Electronics Forum | Wed Jul 28 20:14:22 EDT 1999 | Dave F

| While inspecting incoming PCBs we detected around all plated-through-holes (only there and all in the same place) some halfmoonshaped light rings that match obviously only with the pink ring symptom shown in the IPC-A-600 chapter 2.5.2.. That would

Copper Foil Thickness

Electronics Forum | Sat Jan 08 06:46:33 EST 2022 | jineshjpr

Hi anyone knows what is the minimum copper foil thickness available across the industries to make PCB surface. Intention is to achieve 23 microns of finished copper thickness in a 0.3mm thickness PCB. Ideally if 3 microns plates are available, additi

COPPER THICKNESS IN PTH BARREL HOLE

Electronics Forum | Fri Jan 07 09:03:44 EST 2022 | jineshjpr

Hi Everyone, I want to understand what is the copper thickness to be maintained in PTH Barrel hole. Is this same as Fab recommendation of surface finished copper thickness like 25/35/70 microns..??? Is there any specific IPC standards available to un

Question of delamination in PCB

Electronics Forum | Sat May 09 23:05:17 EDT 2009 | kareal

Davef, It seems the tin resist residue on copper trace is root cause of whitish layer. but it could explian why I could not detect tin on fresh unit without UHAST. I have performed X-section and EDS analysis on many fresh units,but no any tin was


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