Paragon Innovations, Inc. is a leading provider of design services having experience in designing embedded systems in several industries including medical, Internet, telecommunications, automotive, military, retail electronics and PDAs. Paragon desi
Nanovea offers clients worldwide to an unmatched range of Nano, Micro & Macro Mechanical, Metallurgy, Tribology and 3D Non-Contact or AFM materials characterization. Measurements include: Scratch Adhesion, Indentation Hardness, Wear Friction, Elastic
New Equipment | Board Handling - Pallets,Carriers,Fixtures
Blessed with a team of dexterous professionals, our organization counted as leading Exporter, Manufacturer & Supplier of Anti-Static ESD POM Acetal Delring Sheet in Shenzhen, Guangdong, China. Energetic offers copolymer grade of POM Rod, Sheet. is
similar Meldin polyimide is available in five standard grades: Meldin 7001 - Unfilled. Maximum strength & elongation: lowest modulus & thermal conductivity: optimum electrical. Meldin 7021 - 15% graphite (by weight). Enhances inherent wear resist
Polyimide a kind of Heteroaromatic polymers, whose Molecular structure containing polyimide-based monomeric unit. It is a super-performancde Engineering Plastic (250 degree heat can be a long-term job), and has an excellent mechnical and thermal dime
Technical Library | 2015-07-16 17:24:23.0
Qualification of electronic hardware from a corrosion resistance standpoint has traditionally relied on stressing the hardware in a variety of environments. Before the development of tests based on mixed flowing gas (MFG), hardware was typically exposed to temperature-humidity cycling. In the pre-1980s era, component feature sizes were relatively large. Corrosion, while it did occur, did not in general degrade reliability. There were rare instances of the data center environments releasing corrosive gases and corroding hardware. One that got a lot of publicity was the corrosion by sulfur-bearing gases given off by data center carpeting. More often, corrosion was due to corrosive flux residues left on as-manufactured printed circuit boards (PCBs) that led to ion migration induced electrical shorting. Ion migration induced failures also occurred inside the PCBs due to poor laminate quality and moisture trapped in the laminate layers.
Industry Directory | Manufacturer
As trends towards the miniaturization and increased functional integration of electronics, the demands on quality assurance are rising. FISCHER has many coating thickness measurement solutions for the electronics sector.
New Equipment | Solder Materials
SN100C is a lead-free solder alloy developed by Nihon Superior in Japan that is comprised of tin-copper-nickel + germanium. SN100C offers user-friendly properties and has been proven in commercial production since 1999. The result of these advantages
Industry News | 2012-10-16 15:06:07.0
Semblant Ltd. today announced it has expanded its equipment portfolio with the launch of the SPF 1000 and SPF 1500 Plasma Systems. Both systems deliver volume production capability for applying the patented Semblant Plasma Finish (SPF) and are only available from Semblant.
Industry News | 2013-03-04 12:11:10.0
Developed alongside and accepted by the automotive industry, Henkel Electronic Materials announces the commercial availability of 90iSC, a high-reliability, lead-free solder alloy for demanding high-temperature applications. The new alloy, which addresses the drawbacks certain products experience with traditional SAC alloys, has been proven as a viable lead-free solution for applications where extremely high reliability is required.
