Electronics Forum | Sat Oct 18 20:35:25 EDT 2008 | arosario
I see, maybe changing my peak temp in reflow will help. I'll try do eval again... Actually, once I did have evaluated a longer pre-heat but on my previous eval, I didn't change the peak temp. Maybe reflow can help compensate to my problem in the part
Electronics Forum | Fri Aug 14 18:48:36 EDT 2009 | secura1
It's some time difficult to control process when > using a heat gun. What is the intent of using the > heat gun after test? we agree... the heat gun method was an experiment. We are planning to us a hot air re-work station. The intent is to re-
Electronics Forum | Fri Feb 06 09:11:40 EST 2004 | stefwitt
Hi Pete, thank you for your positive feed-back. I was told by a carrier tape vendor, that the tape can�t be re-used for heat sealing. I made some tests myself and found, that if you are going to use exactly the same seam, the cover tape came off quit
Electronics Forum | Wed Nov 19 19:28:59 EST 2003 | bwet
We are looking for recommendations on reliability testing (thermal cycling, vibration, etc.) of BGAs AFTER being soldered to a PCB. Are there any standards that include such things as heating cycles (like a minimum of 5,000 cycles), ball-ball leakag
Electronics Forum | Tue Jul 29 14:25:20 EDT 2014 | kenkay
We have been struggling for a while with some through hole sealed mechanical relays that fail at test after they have been sitting a while. They will initially pass test, but seem to fail if they sit for a few days. We made sure our wave process was
Electronics Forum | Thu Aug 03 10:12:31 EDT 2017 | bspoon
DCS testing has detected exotherming in samples of stock FR4 laminate material. The exotherming subsequently disappears from the heat flow plots when DSC testing is repeated a second time on the same samples. Can this non/ under-cured material cause
Electronics Forum | Fri Jul 26 18:28:51 EDT 2002 | blnorman
Actually this is for an automotive instrument cluster. From what I've been told back in the good old days we switched fluxes and after the car sat in the sun (and heat) a haze developed on the inside of the panel that was attributed to the flux.
Electronics Forum | Fri Mar 26 11:48:45 EST 2004 | patrickbruneel
I know it is not easy to quantify zero. The biggest dilemma the no-residue technology is facing "disbelieve" The most accurate proof to the fact that all solids disapear under heat is TGA analysis. Test the no-residue in your facility under the rig
Electronics Forum | Thu Jun 23 00:28:42 EDT 2005 | KEN
....how does the part perform in a wetting test. Is it solderable on a bench or dip-plating in a pot? If you add flux and heat can you fix your problem assemblies? If yes, plating finish or substrate is not your problem. What flux are you using?
Electronics Forum | Thu Mar 09 16:21:53 EST 2006 | geocominc
Ramp or Soak give us same Deta T (from 35 to 40).All probes are tested o.k.Should we pump in more heat upfront in order to warm up heavy loaded ICs like PLCC64 or Change blower speed? or Slow down line?
