Full Site - : definition of ultra fine pitch component (Page 4 of 25)

Wave of innovation at productronica fair - LPKF presents four new systems in Hall B2, Booth 105

Industry News | 2013-09-10 19:39:14.0

The productronica is an important trade fair for LPKF Laser & Electronics AG. In time for the opening, the specialist in micro-material processing presents four new systems and procedures

LPKF Laser & Electronics

Gen3 Systems to Present SIR Intercomparison to Validate the use of a Fine Pitch Pattern

Industry News | 2017-02-09 08:35:06.0

FARNBOROUGH, UK ― February 2017 ― Gen3 Systems Limited, a specialist British manufacturer and distributor, is pleased to announce that its Chief Technology Officer Dr Chris Hunt will present the paper titled “SIR intercomparison to validate the use of fine pitch pattern” at the upcoming IPC APEX EXPO. The presentation will be held during the session titled “SIR/Flux Reliability” on Tuesday the 14th February between 15:30 – 17:00pm in location 4.

Gen3 Systems

High Frequency Electrical Performance and Thermo-Mechanical Reliability of Fine-Pitch, Copper - Metallized Through-Package-Vias (TPVs) in Ultra - thin Glass Interposers

Technical Library | 2017-08-10 01:23:22.0

This paper demonstrates the high frequency performance and thermo-mechanical reliability of through vias with 25 μm diameter at 50 μm pitch in 100 μm thin glass substrates. Scaling of through via interconnect diameter and pitch has several electrical performance advantages for high bandwidth 2.5D interposers as well as mm-wave components for 5G modules.

Georgia Institute of Technology

Zurvahn LLC Appoints John H. Buckley as Senior Vice President of Sales

Industry News | 2009-05-13 21:48:50.0

COCONUT CREEK, FL � May 2009 � Zurvahn LLC, a leading supply chain management expert, announces the appointment of John H. Buckley as its Senior Vice President of Sales.

Zurvahn LLC

Get a New Level of Soldering Control with Metcal’s Solder Wire Feeder at SMTAI

Industry News | 2016-08-31 18:32:48.0

Metcal today announced plans to exhibit in Booth #806 at SMTA International, scheduled to take place September 27-28, 2016 at the Donald Stephens Convention Center in Rosemont, IL. Company representatives will show the Metcal USF-1000 Solder Wire Feeder, along with Metcal’s proven rework and repair equipment, including the Scarab Site Cleaning System, Scorpion Rework System, MX-5200 Soldering System and more. The new Metcal USF-1000 Solder Wire Feeder adds a new level of control and convenience to the soldering process.

Metcal

Leading Supplier of Soldering Tools to Exhibit at NEPCON China 2013

Industry News | 2013-03-26 08:49:47.0

OK International will demonstrate the new Metcal MX-5200 Soldering, Desoldering and Rework Series in booth 1E41 NEPCON China 2013, scheduled to take place April 23-25, 2013 at the Shanghai World EXPO Exhibition & Convention Center.

OK International

CeTaQ Offers the Ability to Measure All Types of SMT Equipment

Industry News | 2008-05-18 00:59:26.0

HUDSON, NH � May 13, 2008 � CeTaQ, the leader in quality analysis and optimization of SMT production processes, announces that it is able to measure all types of SMT equipment with its flexible mobile measurement method.

CeTaQ Americas, LLC (formerly EAGLE-EYED ONE Sales & Service)

Cobar Solder Products to Exhibit A Range of New Products at IPC/APEX 2010

Industry News | 2010-03-26 23:54:25.0

The Balver Zinn Group announces that Cobar Europe BV will introduce its new Aquasol Branded Water Soluble solder paste in booth #1876 at the upcoming IPC/APEX conference and exhibition, scheduled to take place April 6-8, 2010 at the Mandalay Bay Resort & Convention Center in Las Vegas.

Cobar Solder Products Inc.

PACE to Showcase New TF Series of BGA Rework Systems at IPC APEX EXPO 2019

Industry News | 2019-01-22 13:06:44.0

At IPC Apex 2019, PACE Worldwide will showcase their new TF Series of BGA Rework Systems. The TF1800 is designed for standard board sizes of up to 12” x 12”, while the TF2800 is for extra large, high mass PCB’s up to 24” x 24”. The TF1800 will be on display at our booth (#2809) and will be available for live demonstrations.

PACE Worldwide

PACE to Showcase New TF Series of BGA Rework Systems at IPC APEX EXPO 2019

Industry News | 2019-01-22 16:00:09.0

At IPC Apex 2019, PACE Worldwide will showcase their new TF Series of BGA Rework Systems. The TF1800 is designed for standard board sizes of up to 12” x 12”, while the TF2800 is for extra large, high mass PCB’s up to 24” x 24”.

PACE Worldwide


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