Electronics Forum | Tue Nov 30 11:09:16 EST 2004 | fcox
Mesh opening size may be a factor in whether or not the paste will pass but only in very fine line deposition. Generally speaking, the printed line width and deposition thickness determine what mesh to use. The paste supplier will be able to tell you
Electronics Forum | Thu Feb 26 15:49:48 EST 2009 | GSx
Hi I am looking for informations/specs about graphite/carbon deposited on PWB as a "spring contcat" or land (? not sure how to say in English). - Are there any Standards (IPC?)who define correct thickness of graphite ? - Are there any Test Method
Electronics Forum | Fri Mar 09 05:06:09 EST 2012 | grahamcooper22
Is your solder paste deposit drying out? Or if the paste deposit is small or there is insufficient paste then the tack between the device and paste will be poor so it can easily come out of the paste during its placement or placement of other parts.
Electronics Forum | Mon Oct 02 14:46:06 EDT 2023 | davef
Lab tests can confirm the composition of your material. I'm going with tin oxide. Tin oxide changes color depending on the thickness of the deposit. Your deposit is fairly thin. It will change to a brown color as the thickness increases. Your EDX
Electronics Forum | Wed Nov 03 21:17:40 EST 1999 | Doug B.
Yes this is absolutely true. No-clean flux residue has various affects on the functionality of circuitry especially high impedance circuits. It also affects solderability, and reliability. No-clean flux will always leave a detectable residue. Mos
Electronics Forum | Tue Sep 21 13:17:29 EDT 1999 | Dave F
snip | I've often been tempted to try something a little different when specifying QFP apertures. Like, for example, using long, tapered triangular apertures arranged in alternating directions. The objective being, get the maximum amount of paste do
Electronics Forum | Thu Jul 23 13:11:13 EDT 1998 | Gestapo Allen
I think that in general it's best to deposit paste in order to increase the part standoff. This helps improve the fatigue-life of the joints by providing more strain relief. But I know from experience that it's tough to deposit paste during the rew
Electronics Forum | Tue Jul 28 16:37:24 EDT 1998 | Terry Burnette
| I think that in general it's best to deposit paste in order to increase the part standoff. This helps improve the fatigue-life of the joints by providing more strain relief. But I know from experience that it's tough to deposit paste during the r
Electronics Forum | Thu Jun 16 17:31:14 EDT 2005 | Doug
Chris, From your email I am assuming you are using an immersion tin process. Is that correct? If so, I would highly recommend you talk to your board house about the amount of tin that is being deposited on your boards. If the tin deposit becomes ver
Electronics Forum | Thu Dec 08 01:05:34 EST 2005 | Mike_Kennedy
Our new PCB supplier can give us a 20% price reduction if we convert from an ENIG finish to a FLASH gold finish. My uderstanding between the two is as follows: ENIG - Nickel is plated over copper and then immersed in Gold which forms a self limited f
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