Electronics Forum: dies (Page 4 of 47)

Re: Popcorn effect with PBGA

Electronics Forum | Tue Apr 11 09:45:45 EDT 2000 | emmanuel

Hi Kc, As recommended by the PBGA supplier, the temperature of the package surface should not exceed 225�C during 10 seconds max so as to avoid popcorn effect. Given that some of products reflow profils are specifiing reflow temperature at 250�C,

Re: Die Removal Equipment

Electronics Forum | Sat Feb 06 07:39:30 EST 1999 | Wayne Bracy

| | | I am looking for a piece of equipement that can | safely remove silicon die(200mil by 200mils) from a LTCC board. My present method involves a dental drill which often goes through the dielectric layers and causes scrap. | | | | |

Die attach with solder paste

Electronics Forum | Tue Aug 27 03:45:36 EDT 2002 | seje

Hi there. We are considering to attach die chip with solder paste to the pcb at the SMD line (we are used to attach it with silver epoxy at the die bonding line before). This is a whole new method to me, so I'd like to have some opinions here. Where

Die Crack Monitoring (DCM)

Electronics Forum | Sat Sep 24 16:06:13 EDT 2011 | tech1

Okay so you are picking from a Wafer Frame and it is a UV cured tape. Who's die sorting machine are you using? You mention the ejector needles, but have you checked them? What size are the die and how thick are they? Have you checked the UV cure, i

Hover-Davis DDF, what are your opinions?

Electronics Forum | Tue Jan 23 10:57:54 EST 2001 | mdaley

Hello, I'm currently in the process of determining the best way to place bare die (flip chip) on our substrates. I've seen the Hover-Davis DDF and was impressed by it's capabilities. I particularly like the fact that I won't incur the cost of packa

Photonic Soldering

Electronics Forum | Tue Sep 19 08:53:11 EDT 2000 | DL

Does Photonic soldering work well with Ceramic substrate PCB's? and can it be used for die?

Adhesive Dispense Equipment

Electronics Forum | Mon Oct 29 15:18:31 EST 2001 | Chris

I am attaching bare die using conductive epoxy. Thanks, Chris

Die attach with solder paste

Electronics Forum | Fri Aug 30 06:18:55 EDT 2002 | seje

Thanks Jim, that should help. And yes, there is light at the end of the tunnel.... now : ) -Sasu-

Die and Ply Procedure

Electronics Forum | Wed Jan 26 01:39:12 EST 2005 | sohct

Is there a procedure for the this test? If yes please forward to me. Thx.

Baking prior to conformal coat

Electronics Forum | Wed Jul 20 15:33:38 EDT 2005 | cecil

QC dept. refrain from giving direction!! Geez have I died and gone to heaven?


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