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Eutect introduces service cart for wave soldering modules

Industry News | 2020-12-10 17:21:06.0

To simplify maintenance and servicing of wave soldering modules, Eutect GmbH offers a versatile service cart designed for use directly on the machine. Each service cart is tailored to specific customer modules.

Eutect GmbH

Axel Wolff joins Eutect GmbH as sales manager

Industry News | 2021-04-29 17:11:13.0

In order to coordinate the national and international sales activities as well as the world wide project business even better, the specialist for customized soldering automation expands its staff with the experienced sales expert Axel Wolff.

Eutect GmbH

Evaluating Soldering Irons for Lead Free Assembly -A Quantitative Approach

Technical Library | 2006-09-06 15:25:43.0

Transition to lead free solder stations in electronics packaging has raised issues regarding process, metallurgy and reliability m assemblies. In regards to soldering, lead has been used for thousands of years in a wide range of applications. Conventional eutectic or near eutectic tin-lead solder compositions have been used for virtually all soldering applications in electronics assembly for the last 50 years, In the electronics assembly process, a majority of commercial rework applications and some low density board assembly processes require hand soldering stations (...) This paper describes an attempt to quantify both qualitative and quantitative data that can aid in the evaluation of lead free soldering irons.

T.J. Watson School of Engineering and Applied Science

Anisotropic grain growth and crack propagation in eutectic microstructure under cyclic temperature annealing in flip-chip SnPb composite solder joints

Technical Library | 2014-06-19 18:13:23.0

For high-density electronic packaging,the application of flip-chip solder joints has been well received in the microelectronics industry. High-lead(Pb) solders such as Sn5Pb95 are presently granted immunity from the RoHS requirements for their use in high-end flip-chip devices, especially in military applications. In flip-chip technology for consumer electronic products, organic substrates have replaced ceramic substrates due to the demand for less weight and low cost. However, the liquidus temperatures of high-Pb solders are over 300°C which would damage organic substrates during reflow because of the low glass transition temperature. To overcome this difficulty, the composite solder approach was developed...

National Chiao Tung University

A Study On Process, Strength And Microstructure Analysis Of Low Temperature SnBi Containing Solder Pastes Mixed With Lead-Free Solder Balls

Technical Library | 2021-08-25 16:34:37.0

As the traditional eutectic SnPb solder alloy has been outlawed, the electronic industry has almost completely transitioned to the lead-free solder alloys. The conventional SAC305 solder alloy used in lead-free electronic assembly has a high melting and processing temperature with a typical peak reflow temperature of 245ºC which is almost 30ºC higher than traditional eutectic SnPb reflow profile. Some of the drawbacks of this high melting and processing temperatures are yield loss due to component warpage which has an impact on solder joint formation like bridging, open defects, head on pillow.

Rochester Institute of Technology

Thermal Profiles - Why Getting Them Right is Important

Technical Library | 2019-10-24 14:23:49.0

Presentation given by Fred Dimock during a seminar at the American Competitiveness Institute, ACI. •Recipe vs. Profile •Material Properties •Why profiles are shaped like they are. •Obtaining profiles •TC Accuracy •Profilers •Test vehicles •Process Window – Eutectic vs. Lead Free •Heat transfer •Oven Control

BTU International

New standard cell concept for special soldering automation

Industry News | 2021-08-13 08:28:53.0

In order to be able to offer even higher precision and modularity, Eutect GmbH has developed a scalable standard cell with the automation specialist Taktomat GmbH. The E-cell includes several innovations that enable an even higher degree of individualisation of the solutions around Eutect's special soldering automation.

Eutect GmbH

BGA / SMT Rework & Repair

BGA / SMT Rework & Repair

New Equipment | Rework & Repair Services

Many Fortune 500 clients, and numerous other OEMs and contract manufacturers of micro-electronics rely on Process Sciences to service, modify, reclaim, upgrade, and/or repair their circuit assemblies and array devices. PSI knows solder! Please rememb

Process Sciences, Inc.

KappZapp3.5 - Tin Silver Solder for Stainless Steel to Stainless Steel and Copper

KappZapp3.5 - Tin Silver Solder for Stainless Steel to Stainless Steel and Copper

New Equipment | Solder Materials

Low melting temperatures prevent loss of properties and minimize distortion on thin wires and sheets. KappZapp3.5™ Tin-Silver alloys are used for electronics, fabrication, ducting, food containers, storage bins, instruments, Copper plumbing pipe, and

Kapp Alloy & Wire, Inc

Kapp 509 - Cadmium Zinc Multipurpose Solder

Kapp 509 - Cadmium Zinc Multipurpose Solder

New Equipment | Solder Materials

Cadmium-Zinc solders are medium temperature alloys that provide strong, corrosion- resistant joints on most metals. The eutectic solder is the industry standard, Kapp 509. It melts and solidifies at 509°F and 265°C, making it an ideal solder for oven

Kapp Alloy & Wire, Inc


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Nozzles, Feeders, Spare Parts - Siemens, Fuji, Juki, Yamaha, etc...
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Software for SMT placement & AOI - Free Download.