Electronics Forum | Sun Oct 09 21:44:12 EDT 2005 | Eskay
If the solder in the pot is to be replaced, the cost is very high. Is there any methods that could control the lead content to be low 1000ppm? Any methods what if the content is exceeded 1000ppm?
Electronics Forum | Tue Oct 11 22:58:19 EDT 2005 | KEN
Isn't it funny how solder manufacturers are adopting a spec. limit of "not to exceed 1000ppm of lead content". Doesn't leave much room for the rest of the "process".
Electronics Forum | Sun May 15 22:49:18 EDT 2005 | techknow..
Tech sheet says that sealed container should not exceed 7 days....I have a container that has been out for nine days, what do you think????? Has anyone any similar experience or pointers ??
Electronics Forum | Mon Dec 19 12:21:09 EST 2005 | Amol Kane
from what i know, Tg is important from thermal stresses point of view. board warpage increases greately when Tg is exceed
Electronics Forum | Tue Feb 07 17:47:30 EST 2006 | grantp
Hi, I would say the most worrying defect would be damaged parts due to exceeding their temp specifications. Regards, Grant
Electronics Forum | Mon Mar 27 09:54:35 EST 2006 | russ
Flash gold is usually to thick and will cause embrittlement of your solder joints if concentration exceeds I beleive 6% in the joint
Electronics Forum | Tue Nov 07 16:26:42 EST 2006 | aj
Hi, I trialled 4 or 5 of the main suppliers including Kester. I went with Alpha OM338 SAC305 - exceeded all expectations and actually performs better than PB Paste in my opinion. aj...
Electronics Forum | Wed Feb 07 16:40:15 EST 2007 | russ
Be sure that this component temp during operation does not exceed the low temp of the solder. (it has happened in similar situation) Very good idea though Russ
Electronics Forum | Tue Feb 27 08:36:03 EST 2007 | CAN
I have always locked the setpoint at 130-135F 135 being hte max temp most media beds can handle. If you breach/exceed 140 the media will break down or gum up which will cause many probelms for you.
Electronics Forum | Wed Dec 26 19:45:06 EST 2007 | weekong
Delta T is the temparture different between the highest and lowest measured point on a profile. Ramp and cooling rate should not exceed 4deg c/sec to prevent thermal shock to the components and pcbs. This will also minimise delamination.
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