Industry News | 2010-07-29 15:10:06.0
Universal Instruments’ Advanced Process Lab hosted the first Advanced Research in Electronics Assembly (AREA) Consortium meeting of 2010 at the Treadway Inn in Owego, NY on June 16-17. Nearly 80 attendees from the 29 member companies participated in the two-day event, which will also be presented in subsequent webcasts. Topics ranged from thermal interface assembly to a continuing analysis of lead-free solder microstructure and reliability.
Industry News | 2017-02-10 21:25:25.0
Carlsbad, CA – February 10, 2017. Machine Vision Products (MVP), a leader in Automated Optical Inspection will be demonstrating AOI solutions for SMT and Microelectronics, 3D AOI and advanced software products at IPC APEX EXPO 2017 at the San Diego Convention Center from February 14 to 16. MVP is exhibiting at Booth #2509.
Industry News | 2020-01-21 09:26:05.0
Atlanta, Georgia – A Grand Opening ceremony will be held on Thursday, January 23, 2020 to celebrate the opening of a new Laritech facility in Moorpark, California. “As a long-standing Koh Young partner, we could not be prouder of their growth and trajectory,” said Allen Phung, Regional Sales Manager for Koh Young America. “At the event, visitors will be able to see why Koh Young is proud of the accomplishments reached by Laritech. We look forward to continuing this relationship and supporting their growth.”
Industry News | 2018-10-18 10:23:07.0
Typical RoHS Issues in PCB Assembly
Industry News | 2015-11-04 20:35:17.0
Carlsbad, CA – November 5: Machine Vision Products today announced it would be demonstrating a wide variety of SMT and Microelectonics applications at the Productronica 2015 exhibition. The exhibition is at Messe München in Munich from November 10th to 13th 2015. Machine Vision Products are exhibiting on Booth 270 in Hall A2.
Industry News | 2016-07-08 19:09:41.0
Carlsbad, CA – July 8: Machine Vision Products (MVP) today announced it would be demonstrating their diverse inspection toolbox on the MVP 850 Platform for Microelectronics and Packaging at the Semicon West 2016 exhibition. Applications will include Lead Frame inspection for die placement, epoxy and wire bond as well as demonstrating new surface inspection capabilities. The exhibition is at the Moscone Center in San Francisco from July 12-14 2016. Machine Vision Products are exhibiting at booth #6471 in the North Hall.
Industry News | 2017-07-07 17:15:03.0
Carlsbad, CA – July 7, 2017: Machine Vision Products (MVP) today announced it would be demonstrating its Die Wire Metrology System (DWMS) and Semiconductor Automated Optical Inspection solutions at the Semicon West exhibition. These latest capabilities are available on MVP's 2020 and 850G Platforms. Applications demonstrated will include die wire metrology, wire bond, wafer and surface inspection capabilities. The exhibition is at the Moscone Center in San Francisco from July 11-13, 2017. Machine Vision Products are exhibiting at booth #7724 in the West Hall (Level 1).
Siemens Siplace X4 Pick And Place Machine Siemens Siplace Pick And Place Machine Siemens Pick And Place Machine Siemens Pick and Place Machine Patch speed:120000CPH Dimension:1900×2734 Weight: 3460kg Product description: Siemens Siplac
Siemens Siplace X4 Pick And Place Machine Patch speed:120000CPH Dimension:1900×2734 Weight: 3460kg Product description: Siemens Siplace X4 Pick And Place Machine, Patch speed:120000CPH, Dimension:1900×2734, Weight: 3460kg Siemen
Siemens Siplace X4 Pick And Place Machine Siemens Siplace X4 Pick And Place Machine Patch speed:120000CPH Dimension:1900×2734 Weight: 3460kg Product description: Siemens Siplace X4 Pick And Place Machine-4 rotary IC head 120000CPH, Patc
